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تسجيل مستخدم جديدImproving the Josephson energy in High-T$_c$ superconducting junctions for ultra-fast electronics
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We report the electrical transport in vertical Josephson tunnel junctions (area 400 $mu m$$^2$) using GdBa$_2$Cu$_3$O$_7$$_{-delta}$ electrodes and SrTiO$_3$ as an insulating barrier (with thicknesses between 1 nm and 4 nm). The results show Josephson coupling for junctions with SrTiO$_3$ barriers of 1 nm and 2 nm. The latter displays a Josephson of 8.9 mV at 12 K. This value is larger than the usually observed in planar arrays of junctions. Our results are promising for the development of superconducting electronic devices in the terahertz regime.
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We study the electrical transport of vertically-stacked Josephson tunnel junctions using GdBa$_2$Cu$_3$O$_{7-d}$ electrodes and a BaTiO$_3$ barrier with thicknesses between 1 nm and 3 nm. The junctions with an area of 20 mm x 20 mm were fabricated co
mbining optical lithography and ion etching using GdBa$_2$Cu$_3$O$_{7-d}$ (16 nm) / BaTiO$_3$ (1 - 3 nm) / GdBa$_2$Cu$_3$O$_{7-d}$ (16 nm) trilayers growth by sputtering on (100) SrTiO$_3$. Current-voltage measurements at low temperatures show a Josephson coupling for junctions with BaTiO$_3$ barriers of 1 nm and 2 nm. Reducing the barrier thickness bellow a critical thickness seems to suppress the ferroelectric nature of the BaTiO$_3$. The Josephson coupling temperature is strongly reduced for increasing barrier thicknesses, which may be related to the suppression of the superconducting critical temperature in the bottom GdBa$_2$Cu$_3$O$_{7-d}$ due to stress. The Josephson energies at 12 K are of $approx$ 1.5 mV and $approx$ 7.5 mV for BaTiO$_3$ barriers of 1 nm and 2 nm. Fraunhofer patterns are consistent with fluctuations in the critical current due to structural inhomogeneities in the barriers. Our results are promising for the development of Josephson junctions using high-T$_c$ electrodes with energy gaps much higher than those usually present in conventional low-temperature superconductors.
Conventional Josephson metal-insulator-metal devices are inherently underdamped and exhibit hysteretic current-voltage response due to a very high subgap resistance compared to that in the normal state. At the same time, overdamped junctions with sin
gle-valued characteristics are needed for most superconducting digital applications. The usual way to overcome the hysteretic behavior is to place an external low-resistance normal-metal shunt in parallel with each junction. Unfortunately, such solution results in a considerable complication of the circuitry design and introduces parasitic inductance through the junction. This paper provides a concise overview of some generic approaches that have been proposed in order to realize internal shunting in Josephson heterostructures with a barrier that itself contains the desired resistive component. The main attention is paid to self-shunted devices with local weak-link transmission probabilities so strongly disordered in the interface plane that transmission probabilities are tiny for the main part of the transition region between two superconducting electrodes, while a small part of the interface is well transparent. We consider the possibility of realizing a universal bimodal distribution function and emphasize advantages of such junctions that can be considered as a new class of self-shunted Josephson devices promising for practical applications in superconducting electronics operating at 4.2 K.
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