ﻻ يوجد ملخص باللغة العربية
We present a new technique of VLSI chip-level thermal analysis. We extend a newly developed method of solving two dimensional Laplace equations to thermal analysis of four adjacent materials on a mother board. We implement our technique in C and compare its performance to that of a commercial CAD tool. Our experimental results show that our program runs 5.8 and 8.9 times faster while keeping smaller residuals by 5 and 1 order of magnitude, respectively.
Memory-bound algorithms show complex performance and energy consumption behavior on multicore processors. We choose the lattice-Boltzmann method (LBM) on an Intel Sandy Bridge cluster as a prototype scenario to investigate if and how single-chip perf
We obtain the approximate solutions for the steady temperature profiles of materials with a temperature-dependent thermal absorptivity inside a microannulus with wavy-rough surfaces considering a quasilinear partial differential equation by the bound
We present a detailed theoretical analysis of the implementation of shortcut-to-adiabaticity protocols for the fast transport of neutral atoms with atom chips. The objective is to engineer transport ramps with durations not exceeding a few hundred mi
Hitting the exit node from the entrance node faster on a graph is one of the properties that quantum walk algorithms can take advantage of to outperform classical random walk algorithms. Especially, continuous-time quantum walks on central-random glu
A switch capable of routing microwave signals at cryogenic temperatures is a desirable component for state-of-the-art experiments in many fields of applied physics, including but not limited to quantum information processing, communication and basic