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Room temperature deposition of superconducting Niobium Nitride films by ion beam assisted sputtering

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 Added by Tomas Polakovic
 Publication date 2018
  fields Physics
and research's language is English




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We use room temperature ion beam assisted sputtering (IBAS) to deposit niobium nitride thin films. Electrical and structural characterizations were performed by electric transport and magnetization measurements at variable temperatures, X-ray diffraction and atomic force microscopy. Compared to reactive sputtering of NbN, films sputtered in presence of an ion beam show remarkable increase in the superconducting critical temperature T$_{rm{c}}$, while exhibiting lower sensitivity to nitrogen concentration during deposition. Thickness dependence of the superconducting critical temperature is comparable to films prepared by conventional methods at high substrate temperatures and is consistent with behavior driven by quantum size effects or weak localization.



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The superconducting critical temperature (Tc > 15K) of niobium titanium nitride (NbTiN) thin films allows for low-loss circuits up to 1.1 THz, enabling on-chip spectroscopy and multi-pixel imaging with advanced detectors. The drive for large scale detector microchips is demanding NbTiN films with uniform properties over an increasingly larger area. This article provides an experimental comparison between two reactive d.c. sputter systems with different target sizes: a small target (100mm diameter) and a large target (127 mm x 444.5 mm). This article focuses on maximizing the Tc of the films and the accompanying I-V characteristics of the sputter plasma, and we find that both systems are capable of depositing films with Tc > 15 K. The resulting film uniformity is presented in a second manuscript in this volume. We find that these films are deposited within the transition from metallic to compound sputtering, at the point where target nitridation most strongly depends on nitrogen flow. Key in the deposition optimization is to increase the systems pumping speed and gas flows to counteract the hysteretic effects induced by the target size. Using the I-V characteristics as a guide proves to be an effective way to optimize a reactive sputter system, for it can show whether the optimal deposition regime is hysteresis-free and accessible.
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The vacuum arc is a well-known technique to produce coating with enhanced adhesion and film density. Many cathodic arc deposition systems are actually in use in industry and research. They all work under (high) vacuum conditions in which water vapor pressure is an important source of film contamination, especially in the pulsed arc mode of operation. Here we present a Cathodic Arc system working under Ultra High Vacuum conditions (UHVCA). UHVCA has been used to produce ultra-pure niobium films with excellent structural and electrical properties at a deposition temperature lower than 100oC. The UHVCA technique therefore opens new perspectives for all applications requiring ultra-pure films or, as in the case of Plasma Immersion Ion Implantation, ultra-pure plasmas.
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