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On-chip actuation and readout of mechanical motion is key to characterize mechanical resonators and exploit them for new applications. We capacitively couple a silicon nitride membrane to an off resonant radio-frequency cavity formed by a lumped element circuit. Despite a low cavity quality factor (Q$_mathrm{E}approx$ 7.4) and off resonant, room temperature operation, we are able to parametrize several mechanical modes and estimate their optomechanical coupling strengths. This enables real-time measurements of the membranes driven motion and fast characterization without requiring a superconducting cavity, thereby eliminating the need for cryogenic cooling. Finally, we observe optomechanically induced transparency and absorption, crucial for a number of applications including sensitive metrology, ground state cooling of mechanical motion and slowing of light.
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Aluminum nitride (AlN) has been widely used in microeletromechanical resonators for its excellent electromechanical properties. Here we demonstrate the use of AlN as an optomechanical material that simultaneously offer low optical and mechanical loss. Integrated AlN microring resonators in the shape of suspended rings exhibit high optical quality factor (Q) with loaded Q up to 125,000. Optomechanical transduction of the Brownian motion of a GHz contour mode yields a displacement sensitivity of 6.2times10^(-18)m/Hz^(1/2) in ambient air.
We describe the measurement and modeling of amplitude noise and phase noise in ultra-high Q nanomechanical resonators made from stoichiometric silicon nitride. With quality factors exceeding 2 million, the resonators noise performance is studied with high precision. We find that the amplitude noise can be well described by the thermomechanical model, however, the resonators exhibit sizable extra phase noise due to their intrinsic frequency fluctuations. We develop a method to extract the resonator frequency fluctuation of a driven resonator and obtain a noise spectrum with dependence, which could be attributed to defect motion with broadly distributed relaxation times.
RF reflectometry offers a fast and sensitive method for charge sensing and spin readout in gated quantum dots. We focus in this work on the implementation of RF readout in accumulation-mode gate-defined quantum dots, where the large parasitic capacitance poses a challenge. We describe and test two methods for mitigating the effect of the parasitic capacitance, one by on-chip modifications and a second by off-chip changes. We demonstrate that these methods enable high-performance charge readout in Si/SiGe quantum dots, achieving a fidelity of 99.9% for a measurement time of 1 $mu$s.
Spin qubits in silicon quantum dots offer a promising platform for a quantum computer as they have a long coherence time and scalability. The charge sensing technique plays an essential role in reading out the spin qubit as well as tuning the device parameters and therefore its performance in terms of measurement bandwidth and sensitivity is an important factor in spin qubit experiments. Here we demonstrate fast and sensitive charge sensing by a radio-frequency reflectometry of an undoped, accumulation-mode Si/SiGe double quantum dot. We show that the large parasitic capacitance in typical accumulation-mode gate geometries impedes reflectometry measurements. We present a gate geometry that significantly reduces the parasitic capacitance and enables fast single-shot readout. The technique allows us to distinguish between the singly- and doubly-occupied two-electron states under the Pauli spin blockade condition in an integration time of 0.8 {mu}s, the shortest value ever reported in silicon, by the signal-to-noise ratio of 6. These results provide a guideline for designing silicon spin qubit devices suitable for the fast and high-fidelity readout.
The needs for efficient heat removal and superior thermal conduction in nano/micro devices have triggered tremendous studies in low-dimensional materials with high thermal conductivity. Hexagonal boron nitride (h-BN) is believed to be one of the candidates for thermal management and heat dissipation due to its novel physical properties, i.e. thermal conductor and electrical insulator. Here we reported interfacial thermal resistance between few-layer h-BN and its silicon oxide substrate using differential 3 omega method. The measured interfacial thermal resistance is around ~1.6*10-8 m2K/W for monolayer h-BN and ~3.4*10-8 m2K/W for 12.8nm-thick h-BN in metal/h-BN/SiO2 interfaces. Our results suggest that the voids and gaps between substrate and thick h-BN flakes limit the interfacial thermal conduction. This work provides a deeper understanding of utilizing h-BN flake as lateral heat spreader in electronic and optoelectronic nano/micro devices with further miniaturization and integration.
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