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Register a new userThermal conduction across a boron nitride and silicon oxide interface
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The needs for efficient heat removal and superior thermal conduction in nano/micro devices have triggered tremendous studies in low-dimensional materials with high thermal conductivity. Hexagonal boron nitride (h-BN) is believed to be one of the candidates for thermal management and heat dissipation due to its novel physical properties, i.e. thermal conductor and electrical insulator. Here we reported interfacial thermal resistance between few-layer h-BN and its silicon oxide substrate using differential 3 omega method. The measured interfacial thermal resistance is around ~1.6*10-8 m2K/W for monolayer h-BN and ~3.4*10-8 m2K/W for 12.8nm-thick h-BN in metal/h-BN/SiO2 interfaces. Our results suggest that the voids and gaps between substrate and thick h-BN flakes limit the interfacial thermal conduction. This work provides a deeper understanding of utilizing h-BN flake as lateral heat spreader in electronic and optoelectronic nano/micro devices with further miniaturization and integration.
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The application of low-dimensional materials for heat dissipation requires a comprehensive understanding of the thermal transport at the cross interface, which widely exists in various composite materials and electronic devices. In this work, we proposed an analytical model, named as cross interface model (CIM), to accurately reveal the essential mechanism of the two-dimensional thermal transport at the cross interface. The applicability of CIM is validated through the comparison of the analytical results with molecular dynamics simulations for a typical cross interface of two overlapped boron nitride nanoribbons. Besides, it is figured out that the factor ({eta}) has important influence on the thermal transport besides the thermal resistance inside and between the materials, which is found to be determined by two dimensionless parameters from its expression. Our investigations deepen the understanding of the thermal transport at the cross interface and also facilitate to guide the applications of low-dimensional materials in thermal management.
Self-affine morphology of random interfaces governs their functionalities across tribological, geological, (opto-)electrical and biological applications. However, the knowledge of how energy carriers or generally classical/quantum waves interact with structural irregularity is still incomplete. In this work, we study vibrational energy transport through random interfaces exhibiting different correlation functions on the two-dimensional hexagonal lattice. We show that random interfaces at the atomic scale are Cantor composites populated on geometrical fractals, thus multifractals, and calculate their quantized conductance using atomistic approaches. We obtain a universal scaling law, which contains self-similarity for mass perturbation, and exponential scaling of structural irregularity quantified by fractal dimension. The multifractal nature and Cantor-composite picture may also be extendable to charge and photon transport across random interfaces.
We reported the basal-plane thermal conductivity in exfoliated bilayer hexagonal boron nitride h-BN that was measured using suspended prepatterned microstructures. The h-BN sample suitable for thermal measurements was fabricated by dry-transfer method, whose sample quality, due to less polymer residues on surfaces, is believed to be superior to that of PMMA-mediated samples. The measured room temperature thermal conductivity is around 484 Wm-1K-1(+141 Wm-1K-1/ -24 Wm-1K-1) which exceeds that in bulk h-BN, providing experimental observation of the thickness-dependent thermal conductivity in suspended few-layer h-BN.
In a number of current experiments in the field of spin-caloritronics a temperature gradient across a nanostructured interface is applied and spin-dependent transport phenomena are observed. However, a lack in the interpretation and knowledge let it unclear how the temperature drop across a magnetic nanostructured interface looks like where both phonons and electrons may contribute to thermal transport. We answer this question for the case of a magnetic tunnel junction (MTJ) where the tunneling magneto Seebeck effect occurs. Nevertheless, our results can be extended to other nanostructured interfaces as well. Using an textit{ab initio} method we explicitly calculate phonon and electron thermal conductance across the Fe/MgO/Fe-MTJs by using Greens function method. Further, by estimating the electron-phonon interaction in the Fe leads we are able to calculate the electron and phonon temperature profile across the Fe/MgO/Fe-MTJ. Our results show that there is an electron-phonon temperature imbalance at the Fe-MgO interfaces. In consequence, a revision of the interpretation of current experimental measurements might be necessary.
Interfacial thermal transport between electrodes and polymer electrolytes can play a crucial role in the thermal management of solid-state lithium-ion batteries (SLIBs). Modifying the electrode surface with functional molecules can effectively increase the interfacial thermal conductance (ITC) between electrodes and polymers (e.g., electrolytes, separators); however, how they influence the interfacial thermal transport in SLIBs during charge/discharge remains unknown. In this work, we conduct molecular dynamics (MD) simulations to investigate the ITC between charged electrodes and solid-state polymer electrolytes (SPEs) mixed with ionic liquids (ILs). We find that ILs could self assemble at the electrode surface and act as non-covalent functional molecules that could significantly enhance the interfacial thermal transport during charge/discharge because of the formation of a densely packed cationic or anionic layer at the interface. While the electrostatic interactions between the charged electrode and the IL ions are responsible for forming these dense interfacial layers, the enhancement of ITC is mainly contributed by the increased Lennard-Jones (LJ) interactions between the charged electrodes and ILs. This work may provide useful insights into the understanding of interfacial thermal transport between electrodes and electrolytes of SLIBs during charge/discharge.
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