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Characterization and performance of the ASIC (CITIROC) front-end of the ASTRI camera

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 Added by Domenico Impiombato
 Publication date 2015
  fields Physics
and research's language is English




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The Cherenkov Imaging Telescope Integrated Read Out Chip, CITIROC, is a chip adopted as the front-end of the camera at the focal plane of the imaging Cherenkov ASTRI dual-mirror small size telescope (ASTRI SST-2M) prototype. This paper presents the results of the measurements performed to characterize CITIROC tailored for the ASTRI SST-2M focal plane requirements. In particular, we investigated the trigger linearity and efficiency, as a function of the pulse amplitude. Moreover, we tested its response by performing a set of measurements using a silicon photomultiplier (SiPM) in dark conditions and under light pulse illumination. The CITIROC output signal is found to vary linearly as a function of the input pulse amplitude. Our results show that it is suitable for the ASTRI SST-2M camera.



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The Extended Analogue Silicon Photo-multiplier Integrated Read Out Chip, EASIROC, is a chip proposed as front-end of the camera at the focal plane of the imaging Cherenkov ASTRI SST-2M telescope prototype. This paper presents the results of the measurements performed to characterize EASIROC in order to evaluate its compliance with the ASTRI SST-2M focal plane requirements. In particular, we investigated the trigger time walk and the jitter effects as a function of the pulse amplitude. The EASIROC output signal is found to vary linearly as a function of the input pulse amplitude with very low level of electronic noise and cross-talk (<1%). Our results show that it is suitable as front-end chip for the camera prototype, although, specific modifications are necessary to adopt the device in the final version of the telescope.
221 - C. Agapopoulou , S. Blin , A. Blot 2020
For the High-Luminosity phase of LHC, the ATLAS experiment is proposing the addition of a High Granularity Timing Detector (HGTD) in the forward region to mitigate the effects of the increased pile-up. The chosen detection technology is Low Gain Avalanche Detector (LGAD) silicon sensors that can provide an excellent timing resolution below 50 ps. The front-end read-out ASIC must maintain the performance of the sensor, while keeping low power consumption. This paper presents the results on the first prototype of a front-end ASIC, named ALTIROC0, which contains the analog stages (preamplifier and discriminator) of the read-out chip. The ASIC was characterised both alone and as part of a module with a 2$times$2 LGAD array of 1.1$times$1.1 mm$^2$ pads bump-bonded to it. The various contributions of the electronics to the time resolution were investigated in test-bench measurements with a calibration setup. Both when the ASIC is alone or with a bump-bonded sensor, the jitter of the ASIC is better than 20 ps for an injected charge of 10 fC. The time walk effect that arises from the different response of the preamplifier for various injected charges can be corrected up to 10 ps using a Time Over Threshold measurement. The combined performance of the ASIC and the LGAD sensor, which was measured during a beam test campaign in October 2018 with pions of 120 GeV energy at the CERN SPS, is around 40 ps for all measured modules. All tested modules show good efficiency and time resolution uniformity.
ASTRI (Astrofisica con Specchi a Tecnologia Replicante Italiana), is a flagship project of the Italian Ministry of Education, University and Research whose main goal is the design and construction of an end-to-end prototype of the Small Size of Telescopes of the Cherenkov Telescope Array. The prototype, named ASTRI SST-2M, will adopt a wide field dual mirror optical system in a Schwarzschild-Couder configuration to explore the VHE range of the electromagnetic spectrum. The camera at the focal plane is based on Silicon Photo-Multipliers detectors which is an innovative solution for the detection astronomical Cherenkov light. This contribution reports some preliminary results on the evaluation of the optical cross talk level among the SiPM pixels foreseen for the ASTRI SST-2M camera.
We present our latest ASIC, which is used for the readout of Cadmium Telluride double-sided strip detectors (CdTe DSDs) and high spectroscopic imaging. It is implemented in a 0.35 um CMOS technology (X-Fab XH035), consists of 64 readout channels, and has a function that performs simultaneous AD conversion for each channel. The equivalent noise charge of 54.9 e- +/- 11.3 e- (rms) is measured without connecting the ASIC to any detectors. From the spectroscopy measurements using a CdTe single-sided strip detector, the energy resolution of 1.12 keV (FWHM) is obtained at 13.9 keV, and photons within the energy from 6.4 keV to 122.1 keV are detected. Based on the experimental results, we propose a new low-noise readout architecture making use of a slew-rate limited mode at the shaper followed by a peak detector circuit.
We designed a versatile analog front-end chip, called LTARS, for TPC-applications, primarily targeted at dual-phase liquid Ar-TPCs for neutrino experiments and negative-ion $mu$-TPCs for directional dark matter searches. Low-noise performance and wide dynamic range are two requirements for reading out the signals induced on the TPC readout channels. One of the development objectives is to establish the analog processing circuits under low temperature operation, which are designed on function block basis as reusable IPs (Intellectual Properties). The newly developed ASIC was implemented in the Silterra 180~nm CMOS technology and has 16 readout channels. We carried out the performance test at room temperature and the results showed an equivalent noise charge of 2695$pm$71~e$^-$ (rms) with a detector capacitance of 300~pF. The dynamic range was measured to be 20--100~fC in the low-gain mode and 200--1600~fC in the high-gain mode within 10% integral nonlinearity at room temperature. We also tested the performance at the liquid-Ar temperature and found a deterioration of the noise level with a longer shaper time. Based on these results, we also discuss a unique simulation methodology for future cold-electronics development. This method can be applicable to design the electronics used at low temperature.
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