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Register a new userResolution Studies on Silicon Strip Sensors with fine Pitch
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In June 2008 single-sided silicon strip sensors with 50 $mu$m readout pitch were tested in a highly energetic pion beam at the SPS at CERN. The purpose of the test was to evaluate characteristic detector properties by varying the strip width and the number of intermediate strips. The experimental setup and first results for the spatial resolution are discussed.
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Planar silicon pixel sensors with modified n$^+$-implantation shapes based on the IBL pixel sensor were designed in Dortmund. The sensors with a pixel size of $250,mu$m $times$ $50,mu$m are produced in n$^+$-in-n sensor technology. The charge collection efficiency should improve with electrical field strength maxima created by the different n$^+$-implantation shapes. Therefore, higher particle detection efficiencies at lower bias voltages could be achieved. The modified pixel designs and the IBL standard design are placed on one sensor to test and compare the designs. The sensor can be read out with the FE-I4 readout chip. At the iWoRiD 2018, measurements of sensors irradiated with protons and neutrons respectively at different facilities were presented and showed incongruent results. Unintended annealing during irradiation was considered as an explanation for the observed differences in the hit detection efficiency for two neutron irradiated sensors. This hypothesis will be examined and confirmed in this work, presenting first annealing studies of sensors irradiated with neutrons in Ljubljana.
We have examined the effects of embedded pitch adapters on signal formation in n-substrate silicon microstrip sensors with data from beam tests and simulation. According to simulation, the presence of the pitch adapter metal layer changes the electric field inside the sensor, resulting in slowed signal formation on the nearby strips and a pick-up effect on the pitch adapter. This can result in an inefficiency to detect particles passing through the pitch adapter region. All these effects have been observed in the beam test data.
Pixelated silicon detectors are state-of-the-art technology to achieve precise tracking and vertexing at collider experiments, designed to accurately measure the hit position of incoming particles in high rate and radiation environments. The detector requirements become extremely demanding for operation at the High-Luminosity LHC, where up to 200 interactions will overlap in the same bunch crossing on top of the process of interest. Additionally, fluences up to 2.3 10^16 cm^-2 1 MeV neutron equivalent at 3.0 cm distance from the beam are expected for an integrated luminosity of 3000 fb^-1. In the last decades, the pixel pitch has constantly been reduced to cope with the experiments needs of achieving higher position resolution and maintaining low pixel occupancy per channel. The spatial resolution improves with a decreased pixel size but it degrades with radiation damage. Therefore, prototype sensor modules for the upgrade of the experiments at the HL-LHC need to be tested after being irradiated. This paper describes position resolution measurements on planar prototype sensors with 100x25 um^2 pixels for the CMS Phase-2 Upgrade. It reviews the dependence of the position resolution on the relative inclination angle between the incoming particle trajectory and the sensor, the charge threshold applied by the readout chip, and the bias voltage. A precision setup with three parallel planes of sensors has been used to investigate the performance of sensors irradiated to fluences up to F_eq = 3.6 10^15 cm-2. The measurements were performed with a 5 GeV electron beam. A spatial resolution of 3.2 +- 0.1 um is found for non-irradiated sensors, at the optimal angle for charge sharing. The resolution is 5.0 +/- 0.2 um for a proton-irradiated sensor at F_eq = 2.1 10^15 cm-2 and a neutron-irradiated sensor at F_eq = 3.6 10^15 cm^-2.
The timing performance of silicon sensors bump-bonded to Timepix3 ASICs is investigated, prior to and after different types of irradiation up to $8 times 10^{15} 1 mathrm{,Mekern -0.1em V} mathrm{ ,n_{eq}} {mathrm{ ,cm}}^{-2}$. The sensors have been tested with a beam of charged particles in two different configurations, perpendicular to and almost parallel to the incident beam. The second approach, known as the grazing angles method, is shown to be a powerful method to investigate not only the charge collection, but also the time-to-threshold properties as a function of the depth at which the charges are liberated.
The STAR Silicon Strip Detector (SSD) completes the three layers of the Silicon Vertex Tracker (SVT) to make an inner tracking system located inside the Time Projection Chamber (TPC). This additional fourth layer provides two dimensional hit position and energy loss measurements for charged particles, improving the extrapolation of TPC tracks through SVT hits. To match the high multiplicity of central Au+Au collisions at RHIC the double sided silicon strip technology was chosen which makes the SSD a half million channels detector. Dedicated electronics have been designed for both readout and control. Also a novel technique of bonding, the Tape Automated Bonding (TAB), was used to fullfill the large number of bounds to be done. All aspects of the SSD are shortly described here and test performances of produced detection modules as well as simulated results on hit reconstruction are given.
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