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Register a new userFirst Annealing Studies of Irradiated Silicon Sensors with Modified ATLAS Pixel Implantations
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Planar silicon pixel sensors with modified n$^+$-implantation shapes based on the IBL pixel sensor were designed in Dortmund. The sensors with a pixel size of $250,mu$m $times$ $50,mu$m are produced in n$^+$-in-n sensor technology. The charge collection efficiency should improve with electrical field strength maxima created by the different n$^+$-implantation shapes. Therefore, higher particle detection efficiencies at lower bias voltages could be achieved. The modified pixel designs and the IBL standard design are placed on one sensor to test and compare the designs. The sensor can be read out with the FE-I4 readout chip. At the iWoRiD 2018, measurements of sensors irradiated with protons and neutrons respectively at different facilities were presented and showed incongruent results. Unintended annealing during irradiation was considered as an explanation for the observed differences in the hit detection efficiency for two neutron irradiated sensors. This hypothesis will be examined and confirmed in this work, presenting first annealing studies of sensors irradiated with neutrons in Ljubljana.
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The innermost part of the tracking detector of the ATLAS experiment consists mainly of planar n$^+$-in-n silicon pixel sensors. During the phase-0 upgrade, the Insertable B-Layer (IBL) was installed closest to the beam pipe. Its pixels are arranged with a pitch of $250,mu$m$,times,50,mu$m with a rectangular shaped n$^+$ implantation. Based on this design modified pixel designs have been developed in Dortmund. Six of these new pixel designs are arranged in structures of ten columns and were placed beside structures with the standard design on one sensor. Because of a special guard ring design, each structure can be powered and investigated separately. Several of these sensors were bump bonded to FE-I4 read-out chips. One of these modules was irradiated with reactor neutrons up to a fluence of $5 times 10^{15} , n_{text{eq}}text{cm}^{-2}$. This contribution presents important sensor characteristics, charge collection determined with radioactive sources and hit efficiency measurements, performed in laboratory and test beam, of this irradiated device. It is shown that the new modified designs perform similar or better than the IBL standard design in terms of charge collection and tracking efficiency, at the cost of a slightly increased leakage current.
In this paper we discuss the measurement of charge collection in irradiated silicon pixel sensors and the comparison with a detailed simulation. The simulation implements a model of radiation damage by including two defect levels with opposite charge states and trapping of charge carriers. The modeling proves that a doubly peaked electric field generated by the two defect levels is necessary to describe the data and excludes a description based on acceptor defects uniformly distributed across the sensor bulk. In addition, the dependence of trap concentrations upon fluence is established by comparing the measured and simulated profiles at several fluences and bias voltages.
In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. Because of its radiation hardness and cost effectiveness, the n-on-p silicon technology is a promising candidate for a large area pixel detector. The paper reports on the joint development, by LPNHE and FBK of novel n-on-p edgeless planar pixel sensors, making use of the active trench concept for the reduction of the dead area at the periphery of the device. After discussing the sensor technology, a complete overview of the electrical characterization of several irradiated samples will be discussed. Some comments about detector modules being assembled will be made and eventually some plans will be outlined.
The ATLAS experiment at the LHC will replace its current inner tracker system for the HL-LHC era. 3D silicon pixel sensors are being considered as radiation-hard candidates for the innermost layers of the new fully silicon-based tracking detector. 3D sensors with a small pixel size of $mathrm{50 times 50~mu m^{2}}$ and $mathrm{25 times 100~mu m^{2}}$ compatible with the first prototype ASIC for the HL-LHC, the RD53A chip, have been studied in beam tests after uniform irradiation to $mathrm{5 times 10^{15}~n_{eq}/cm^{2}}$. An operation voltage of only 50 V is needed to achieve a 97% hit efficiency after this fluence.
In view of the LHC upgrade phases towards HL-LHC, the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness, that allow for enlarging the area instrumented with pixel detectors. We report on the development of novel n-in-p edgeless planar pixel sensors fabricated at FBK (Trento, Italy), making use of the active edge concept for the reduction of the dead area at the periphery of the device. After discussing the sensor technology and fabrication process, we present device simulations (pre- and post-irradiation) performed for different sensor configurations. First preliminary results obtained with the test-structures of the production are shown.
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