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Register a new userSignal coupling to embedded pitch adapters in silicon sensors
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We have examined the effects of embedded pitch adapters on signal formation in n-substrate silicon microstrip sensors with data from beam tests and simulation. According to simulation, the presence of the pitch adapter metal layer changes the electric field inside the sensor, resulting in slowed signal formation on the nearby strips and a pick-up effect on the pitch adapter. This can result in an inefficiency to detect particles passing through the pitch adapter region. All these effects have been observed in the beam test data.
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In June 2008 single-sided silicon strip sensors with 50 $mu$m readout pitch were tested in a highly energetic pion beam at the SPS at CERN. The purpose of the test was to evaluate characteristic detector properties by varying the strip width and the number of intermediate strips. The experimental setup and first results for the spatial resolution are discussed.
A new generation of 3D silicon pixel detectors with a small pixel size of 50$times$50 and 25$times$100 $mu$m$^{2}$ is being developed for the HL-LHC tracker upgrades. The radiation hardness of such detectors was studied in beam tests after irradiation to HL-LHC fluences up to $1.4times10^{16}$ n$_{mathrm{eq}}$/cm$^2$. At this fluence, an operation voltage of only 100 V is needed to achieve 97% hit efficiency, with a power dissipation of 13 mW/cm$^2$ at -25$^{circ}$C, considerably lower than for previous 3D sensor generations and planar sensors.
Several future high-energy physics facilities are currently being planned. The proposed projects include high energy $e^+ e^-$ circular and linear colliders, hadron colliders and muon colliders, while the Electron-Ion Collider (EIC) has already been approved for construction at the Brookhaven National Laboratory. Each proposal has its own advantages and disadvantages in term of readiness, cost, schedule and physics reach, and each proposal requires the design and production of specific new detectors. This paper first presents the performances required to the future silicon tracking systems at the various new facilities, and then it illustrates a few possibilities for the realization of such silicon trackers. The challenges posed by the future facilities require a new family of silicon detectors, where features such as impact ionization, radiation damage saturation, charge sharing, and analog readout are exploited to meet these new demands.
Pixelated silicon detectors are state-of-the-art technology to achieve precise tracking and vertexing at collider experiments, designed to accurately measure the hit position of incoming particles in high rate and radiation environments. The detector requirements become extremely demanding for operation at the High-Luminosity LHC, where up to 200 interactions will overlap in the same bunch crossing on top of the process of interest. Additionally, fluences up to 2.3 10^16 cm^-2 1 MeV neutron equivalent at 3.0 cm distance from the beam are expected for an integrated luminosity of 3000 fb^-1. In the last decades, the pixel pitch has constantly been reduced to cope with the experiments needs of achieving higher position resolution and maintaining low pixel occupancy per channel. The spatial resolution improves with a decreased pixel size but it degrades with radiation damage. Therefore, prototype sensor modules for the upgrade of the experiments at the HL-LHC need to be tested after being irradiated. This paper describes position resolution measurements on planar prototype sensors with 100x25 um^2 pixels for the CMS Phase-2 Upgrade. It reviews the dependence of the position resolution on the relative inclination angle between the incoming particle trajectory and the sensor, the charge threshold applied by the readout chip, and the bias voltage. A precision setup with three parallel planes of sensors has been used to investigate the performance of sensors irradiated to fluences up to F_eq = 3.6 10^15 cm-2. The measurements were performed with a 5 GeV electron beam. A spatial resolution of 3.2 +- 0.1 um is found for non-irradiated sensors, at the optimal angle for charge sharing. The resolution is 5.0 +/- 0.2 um for a proton-irradiated sensor at F_eq = 2.1 10^15 cm-2 and a neutron-irradiated sensor at F_eq = 3.6 10^15 cm^-2.
A new method for the extraction of the electric field in the bulk of heavily irradiated silicon pixel sensors is presented. It is based on the measurement of the Lorentz deflection and mobility of electrons as a function of depth. The measurements were made at the CERN H2 beam line, with the beam at a shallow angle with respect to the pixel sensor surface. The extracted electric field is used to simulate the charge collection and the Lorentz deflection in the pixel sensor. The simulated charge collection and the Lorentz deflection is in good agreement with the measurements both for non-irradiated and irradiated up to 1E15 neq/cm2 sensors.
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