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A Novel Piezoelectric Microtransformer for Autonmous Sensors Applications

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 Publication date 2008
and research's language is English




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This work relates to a novel piezoelectric transformer to be used in an autonomous sensor unit, possibly in conjunction with a RF-MEMS retro-modulator.



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101 - H.K. Ma , B.R. Hou , H.Y. Wu 2008
In this study, a new type of thin, compact, and light weighed diaphragm micro-pump has been successfully developed to actuate the liquid by the vibration of a diaphragm. The micro-diaphragm pump with two valves is fabricated in an aluminum case by using highly accurate CNC machine, and the cross-section dimension is 5mm x 8mm. Both valves and diaphragm are manufactured from PDMS. The amplitude of vibration by a piezoelectric device produces an oscillating flow which may change the chamber volume by changing the curvature of a diaphragm. Several experimental set-ups for performance test in a single micro-diaphragm pump, isothermal flow open system, and a closed liquid cooling system is designed and implemented. The performance of one-side actuating micro-diaphragm pump is affected by the design of check valves, diaphragm, piezoelectric device, chamber volume, input voltage and frequency. The measured maximum flow rate of present design is 72 ml/min at zero total pump head in the range of operation frequency 70-180 Hz.
The minimum spanning tree clustering algorithm is capable of detecting clusters with irregular boundaries. In this paper we propose two minimum spanning trees based clustering algorithm. The first algorithm produces k clusters with center and guaranteed intra-cluster similarity. The radius and diameter of k clusters are computed to find the tightness of k clusters. The variance of the k clusters are also computed to find the compactness of the clusters. The second algorithm is proposed to create a dendrogram using the k clusters as objects with guaranteed inter-cluster similarity. The algorithm is also finds central cluster from the k number of clusters. The first algorithm uses divisive approach, where as the second algorithm uses agglomerative approach. In this paper we used both the approaches to find Informative Meta similarity clusters.
In this research, a novel contact resistance model for the flat panel display (FPD) packaging based on the within layer parallel and between layers series resistance concepts was proposed. The FJ2530 anisotropic conductive films (ACF) by Sony Inc. containing the currently smallest 3micron conductive particles was used to conduct the experiments to verify the accuracy of the proposed model. Calculated resistance of the chip-on-glass (COG) packaging by the proposed model is 0.163Omega. It is found that the gold bump with 0.162Omega resistance play the major role of the overall resistance. Although the predicted resistance by the proposed model is only one third of the experimentally measured value, it has been three-fold improvement compared to the existing models.
The present study presents a new micro electromagnetic actuator utilizing a PDMS membrane with a magnet. The actuator is integrated with micro coils to electromagnetically actuate the membrane and results in a large deflection. The micro electromagnetic actuator proposed in this study is easily fabricated and is readily integrated with existing bio-medical chips due to its planar structure.
This paper reports on the systematic electromechanical characterization of a new three-axial force sensor used in dimensional metrology of micro components. The siliconbased sensor system consists of piezoresistive mechanicalstress transducers integrated in thin membrane hinges supporting a suspended flexible cross structure. The mechanical behavior of the fragile micromechanical structure isanalyzed for both static and dynamic load cases. This work demonstrates that the silicon microstructure withstands static forces of 1.16N applied orthogonally to the front-side of the structure. A statistical Weibull analysis of the measured data shows that these values are significantly reduced if the normal force is applied to the back of the sensor. Improvements of the sensor system design for future development cycles are derived from the measurement results.
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