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Register a new userElectromechanical Reliability Testing of Three-Axial Silicon Force Sensors
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EDA Publishing Association
Publication date
2007
fields
Informatics Engineering
and research's language is
English
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This paper reports on the systematic electromechanical characterization of a new three-axial force sensor used in dimensional metrology of micro components. The siliconbased sensor system consists of piezoresistive mechanicalstress transducers integrated in thin membrane hinges supporting a suspended flexible cross structure. The mechanical behavior of the fragile micromechanical structure isanalyzed for both static and dynamic load cases. This work demonstrates that the silicon microstructure withstands static forces of 1.16N applied orthogonally to the front-side of the structure. A statistical Weibull analysis of the measured data shows that these values are significantly reduced if the normal force is applied to the back of the sensor. Improvements of the sensor system design for future development cycles are derived from the measurement results.
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The very significant growth of the wireless communication industry has spawned tremendous interest in the development of high performances radio frequencies (RF) components. Micro Electro Mechanical Systems (MEMS) are good candidates to allow reconfigurable RF functions such as filters, oscillators or antennas. This paper will focus on the MEMS electromechanical resonators which show interesting performances to replace SAW filters or quartz reference oscillators, allowing smaller integrated functions with lower power consumption. The resonant frequency depends on the material properties, such as Youngs modulus and density, and on the movable mechanical structure dimensions (beam length defined by photolithography). Thus, it is possible to obtain multi frequencies resonators on a wafer. The resonator performance (frequency, quality factor) strongly depends on the environment, like moisture or pressure, which imply the need for a vacuum package. This paper will present first resonator mechanisms and mechanical behaviors followed by state of the art descriptions with applications and specifications overview. Then MEMS resonator developments at STMicroelectronics including FEM analysis, technological developments and characterization are detailed.
This work relates to a novel piezoelectric transformer to be used in an autonomous sensor unit, possibly in conjunction with a RF-MEMS retro-modulator.
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The rapid incursion of new technologies such as MEMS and smart sensor device manufacturing requires new tailor-made packaging designs. In many applications these devices are exposed to humid environments. Since the penetration of moisture into the package may result in internal corrosion or shift of the operating parameters, the reliability testing of hermetically sealed packages has become a crucial question in the semiconductor industry.
Questions of fairness, robustness, and transparency are paramount to address before deploying NLP systems. Central to these concerns is the question of reliability: Can NLP systems reliably treat different demographics fairly and function correctly in diverse and noisy environments? To address this, we argue for the need for reliability testing and contextualize it among existing work on improving accountability. We show how adversarial attacks can be reframed for this goal, via a framework for developing reliability tests. We argue that reliability testing -- with an emphasis on interdisciplinary collaboration -- will enable rigorous and targeted testing, and aid in the enactment and enforcement of industry standards.
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