ترغب بنشر مسار تعليمي؟ اضغط هنا

Experimental Extraction and Simulation of Charge Trapping during Endurance of FeFET with TiN/HfZrO/SiO2/Si (MFIS) Gate Structure

60   0   0.0 ( 0 )
 نشر من قبل Shujing Zhao
 تاريخ النشر 2021
  مجال البحث فيزياء
والبحث باللغة English




اسأل ChatGPT حول البحث

We investigate the charge trapping during endurance fatigue of FeFET with TiN/Hf0.5Zr0.5O2/SiO2/Si (MFIS) gate structure. We propose a method of experimentally extracting the number of trapped charges during the memory operation, by measuring the charges in the metal gate and Si substrate. We verify that the amount of trapped charges increases during the endurance fatigue process. This is the first time that the trapped charges are directly experimentally extracted and verified to increase during endurance fatigue. Moreover, we model the interplay between the trapped charges and ferroelectric polarization switching during endurance fatigue. Through the consistency of experimental results and simulated data, we demonstrate that as the memory window decreases: 1) The ferroelectric characteristic of Hf0.5Zr0.5O2 is not degraded. 2) The trap density in the upper bandgap of the gate stacks increases. 3) The reason for memory window decrease is increased trapped electrons after program operation but not related to hole trapping/de-trapping. Our work is helpful to study the charge trapping behavior of FeFET and the related endurance fatigue process.



قيم البحث

اقرأ أيضاً

We study the impact of different interlayers and ferroelectric materials on charge trapping during the endurance fatigue of Si FeFET with TiN/HfxZr1-xO2/interlayer/Si (MFIS) gate stack. We have fabricated FeFET devices with different interlayers (SiO 2 or SiON) and HfxZr1-xO2 materials (x=0.75, 0.6, 0.5), and directly extracted the charge trapping during endurance fatigue. We find that: 1) The introduction of the N element in the interlayer suppresses charge trapping and defect generation, and improves the endurance characteristics. 2) As the spontaneous polarization (Ps) of the HfxZr1-xO2 decreases from 25.9 {mu}C/cm2 (Hf0.5Zr0.5O2) to 20.3 {mu}C/cm2 (Hf0.6Zr0.4O2), the charge trapping behavior decreases, resulting in the slow degradation rate of memory window (MW) during program/erase cycling; in addition, when the Ps further decreases to 8.1 {mu}C/cm2 (Hf0.75Zr0.25O2), the initial MW nearly disappears (only ~0.02 V). Thus, the reduction of Ps could improve endurance characteristics. On the contract, it can also reduce the MW. Our work helps design the MFIS gate stack to improve endurance characteristics.
Ab initio techniques are used to calculate the effective work function (Weff) of a TiN/HfO2/SiO2/Si stack representing a metal-oxide-semiconductor (MOS) transistor gate taking into account first order many body effects. The required band offsets were calculated at each interface varying its composition. Finally the transitivity of LDA calculated bulk band lineups were used and completed by MBPT bulk corrections for the terminating materials (Si and TiN) of the MOS stack. With these corrections the ab initio calculations predict a Weff of a TiN metal gate on HfO2 to be close to 5.0 eV.
Analytical modeling and dynamics of multidomain in metal-ferroelectric-insulator-semiconductor (MFIS)-FETs are presented in this paper. The formation of multi-domain (MD) leads to oscillations in the conduction band in the channel and periodicity in the local electric field in the ferroelectric region. The impact of 2-D local electric field on the MD switching is captured in the model using the domain wall velocity concept. The optimum values of oxide thickness, ferroelectric thickness and channel length are calculated which corresponds to mono-domain device operation. Deviation from the optimum device parameters causes the transition of mono-domain state to multi-domain state in the ferroelectric. This work can be used as a guideline for designing MFIS-NCFETs, which provides the device parameters that leads to monodomain state in the MFIS-NCFET.
We fabricate planar all-graphene field-effect transistors with self-aligned side-gates at 100 nm from the main graphene conductive channel, using a single lithographic step. We demonstrate side-gating below 1V with conductance modulation of 35% and t ransconductance up to 0.5 mS/mm at 10 mV drain bias. We measure the planar leakage along the SiO2/vacuum gate dielectric over a wide voltage range, reporting rapidly growing current above 15 V. We unveil the microscopic mechanisms driving the leakage, as Frenkel-Poole transport through SiO2 up to the activation of Fowler-Nordheim tunneling in vacuum, which becomes dominant at high voltages. We report a field-emission current density as high as 1uA/um between graphene flakes. These findings are essential for the miniaturization of atomically thin devices.
We fabricated linear arrangements of multiple splitgate devices along an SOI mesa, thus forming a 2xN array of individually controllable Si quantum dots (QDs) with nearest neighbor coupling. We implemented two different gate reflectometry-based reado ut schemes to either probe spindependent charge movements by a coupled electrometer with single-shot precision, or directly sense a spin-dependent quantum capacitance. These results bear significance for fast, high-fidelity single-shot readout of large arrays of foundrycompatible Si MOS spin qubits.
التعليقات
جاري جلب التعليقات جاري جلب التعليقات
سجل دخول لتتمكن من متابعة معايير البحث التي قمت باختيارها
mircosoft-partner

هل ترغب بارسال اشعارات عن اخر التحديثات في شمرا-اكاديميا