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The PhaseII Upgrades of CMS are being planned for the High Luminosity LHC (HL-LHC) era when the mean number of interactions per beam crossing (in-time pileup) is expected to reach ~140-200. The potential backgrounds arising from mis-associated jets and photon showers, for example, during event reconstruction could be reduced if physics objects are tagged with an event time. This tag is fully complementary to the event vertex which is already commonly used to reduce mis-reconstruction. Since the tracking vertex resolution is typically ~10^{-3} (50 micron/4.8cm) of the rms vertex distribution, whereas only ~10^{-1} (i.e. 20 vs.170 picoseconds (psec)) is demonstrated for timing, it is often assumed that only photon (i.e. EM calorimeter or shower-max) timing is of interest. We show that the optimal solution will likely be a single timing layer which measures both charged particle and photon time (a pre-shower layer).
We present the implementation and verification of an in-pixel automatic threshold calibration circuit for the CMS Endcap Timing Layer (ETL) in the High-Luminosity LHC upgrade. The discriminator threshold of the ETL readout chip (ETROC) needs to be ca
We present the design and test results of a Time-to-Digital-Converter (TDC). The TDC will be a part of the readout ASIC, called ETROC, to read out Low-Gain Avalanche Detectors (LGADs) for the CMS Endcap Timing Layer (ETL) of High-Luminosity LHC upgra
The high pseudo-rapidity region of the CMS muon system is covered by Cathode Strip Chambers (CSC) only and lacks redundant coverage despite the fact that it is a challenging region for muons in terms of backgrounds and momentum resolution. In order t
We present the characterization of a readout Application-Specific Integrated Circuit (ASIC) for the CMS Endcap Timing Layer (ETL) of the High-Luminosity LHC upgrade with charge injection. The ASIC, named ETROC and developed in a 65 nm CMOS technology
The CMS beam and radiation monitoring subsystem BCM1F (Fast Beam Condition Monitor) consists of 8 individual diamond sensors situated around the beam pipe within the pixel detector volume, for the purpose of fast bunch-by-bunch monitoring of beam bac