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تسجيل مستخدم جديدThe Belle-II Pixel Vertex Detector at the SuperKEKB Flavor Factory
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An upgraded asymmetric e+e- flavor factory, SuperKEKB, is planned at KEK. It will deliver a luminosity of 8 x 10^35 cm^-2 s^-1, allowing precision measurements in the flavor sector which can probe new physics well beyond the scales accessible to direct observation. The increased luminosity also requires upgrades of the Belle detector. Of critical importance here is a new silicon pixel vertex tracker, which will significantly improve the decay vertex resolution. This new detector will consist of two detector layers close to the interaction point, using DEPFET pixel sensors with 50 um thick silicon in the active area.
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We present an FPGA-based online data reduction system for the pixel detector of the future Belle II experiment. The occupancy of the pixel detector is estimated at 3 %. This corresponds to a data output rate of more than 20 GB/s after zero suppressio
n, dominated by background. The Online Selection Nodes (ONSEN) system aims to reduce the background data by a factor of 30. It consists of 33 MicroTCA cards, each equipped with a Xilinx Virtex-5 FPGA and 4 GiB DDR2 RAM. These cards are hosted by 9 AdvancedTCA carrier boards. The ONSEN system buffers the entire output data from the pixel detector for up to 5 seconds. During this time, the Belle II high-level trigger PC farm performs an online event reconstruction, using data from the other Belle II subdetectors. It extrapolates reconstructed tracks to the layers of the pixel detector and defines regions of interest around the intercepts. Based on this information, the ONSEN system discards all pixels not inside a region of interest before sending the remaining hits to the event builder system. During a beam test with one layer of the pixel detector and four layers of the surrounding silicon strip detector, including a scaled-down version of the high-level trigger and data acquisition system, the pixel data reduction using regions of interest was exercised. We investigated the data produced in more than 20 million events and verified that the ONSEN system behaved correctly, forwarding all pixels inside regions of interest and discarding the rest.
The Belle-II experiment and superKEKB accelerator will form a next generation B-factory at KEK, capable of running at an instantaneous luminosity 40 times higher than the Belle detector and KEKB. This will allow for the elucidation of many facets of
the Standard Model by performing precision measurements of its parameters, and provide sensitivity to many rare decays that are currently inaccessible. This will require major upgrades to both the accelerator and detector subsystems. The imaging Time-of-propagation (iTOP) detector will be a new subdetector of Belle-II that will perform an integral role in Particle identification (PID). It will comprise 16 modules between the tracking detectors and calorimeter; each module consisting of a quartz radiator, approximately 2.5m in length, instrumented with an array of 32 micro-channel plate photodetectors (MCP-PMTs). The passage of charged particles through the quartz will produce a cone of Cherenkov photons that will propagate along the length of the quartz, and be detected by the MCP-PMTs. The excellent spatial, and timing resolution (of 50 picoseconds) of the iTOP system will provide superior particle identification capabilities, particularly allowing for enhanced discrimination between pions and kaons that will be essential for many of the key measurements to performed. The status of the construction of the iTOP subdetector, and performance studies of prototypes at beam tests will be presented, together with prospects for physics measurements that will utilise the PID capabilities of the iTOP system.
The Belle II experiment at the Super B factory SuperKEKB, an asymmetric $e^+e^-$ collider located in Tsukuba, Japan, is tailored to perform precision B physics measurements. The centre of mass energy of the collisions is equal to the rest mass of the
$Upsilon(4S)$ resonance of $m_{Upsilon(4S)} = 10.58,rm GeV$. A high vertex resolution is essential for measuring the decay vertices of B mesons. Typical momenta of the decay products are ranging from a few tens of MeV to a few GeV and multiple scattering has a significant impact on the vertex resolution. The VerteX Detector (VXD) for Belle II is therefore designed to have as little material as possible inside the acceptance region. Especially the innermost two layers, populated by the PiXel Detector (PXD), have to be ultra-thin. The PXD is based on DEpleted P-channel Field Effect Transistors (DEPFETs) with a thickness of only $75,rmmu m$. Spatial resolution and hit efficiency of production detector modules were studied in beam tests performed at the DESY test beam facility. The spatial resolution was investigated as a function of the incidence angle and improvements due to charge sharing are demonstrated. The measured module performance is compatible with the requirements for Belle II.
We have developed a prototype system for the ILC vertex detector based on DEPFET pixels. The system operates a 128x64 matrix (with ~35x25 square micron large pixels) and uses two dedicated microchips, the SWITCHER II chip for matrix steering and the
CURO II chip for readout. The system development has been driven by the final ILC requirements which above all demand a detector thinned to 50 micron and a row wise read out with line rates of 20MHz and more. The targeted noise performance for the DEPFET technology is in the range of ENC=100 e-. The functionality of the system has been demonstrated using different radioactive sources in an energy range from 6 to 40keV. In recent test beam experiments using 6GeV electrons, a signal-to-noise ratio of S/N~120 has been achieved with present sensors being 450 micron thick. For improved DEPFET systems using 50 micron thin sensors in future, a signal-to-noise of 40 is expected.
On-detector digital electronics in High-Energy Physics experiments is increasingly being implemented by means of SRAM-based FPGA, due to their capabilities of reconfiguration, real-time processing and multi-gigabit data transfer. Radiation-induced si
ngle event upsets in the configuration hinder the correct operation, since they may alter the programmed routing paths and logic functions. In most trigger and data acquisition systems, data from several front-end modules are concentrated into a single board, which then transmits data to back-end electronics for acquisition and triggering. Since the front-end modules are identical, they host identical FPGAs, which are programmed with the same bitstream. In this work, we present a novel scrubber capable of correcting radiation-induced soft-errors in the configuration of SRAM-based FPGAs by majority voting across different modules. We show an application of this system to the read-out electronics of the Aerogel Ring Imaging CHerenkov (ARICH) subdetector of the Belle2 experiment at SuperKEKB of the KEK laboratory (Tsukuba, Japan). We discuss the architecture of the system and its implementation in a Virtex-5 LX50T FPGA, in the concentrator board, for correcting the configuration of up to six Spartan-6 LX45 FPGAs, on pertaining front-end modules. We discuss results from fault-injection and neutron irradiation tests at the TRIGA reactor of the Jozef Stefan Institute (Ljubljana, Slovenia) and we compare the performance of our solution to the Xilinx Soft Error Mitigation controller.
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