We present a new technique of VLSI chip-level thermal analysis. We extend a newly developed method of solving two dimensional Laplace equations to thermal analysis of four adjacent materials on a mother board. We implement our technique in C and comp
are its performance to that of a commercial CAD tool. Our experimental results show that our program runs 5.8 and 8.9 times faster while keeping smaller residuals by 5 and 1 order of magnitude, respectively.
