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Register a new userPrototyping of a 25 Gbps optical transmitter for applications in high-energy physics experiments
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Development of optical links with 850 nm multi-mode vertical-cavity surface-emitting lasers (VCSELs) has advanced to 25 Gbps in speed. For applications in high-energy experiments, the transceivers are required to be tolerant in radiation and particle fields. We report on prototyping of a miniature transmitter named MTx+, which is developed for high speed transmission with the dual-channel laser driver LOCld65 and 850 nm VCSELs packaged in TOSA format. The LOCld65 is fabricated in the TSMC 65 nm process and is packaged in the QFN-40 for assembly. The MTx+ modules and test kits were first made with PCB and components qualified for 10 Gbps applications, and were tested for achieving 14 Gbps. The data transfer rate of the MTx+ module is investigated further for the speed of up to 25 Gbps. The LOCld65 is examined with post-layout simulation and the module design upgraded with components including the TOSA qualified for 25 Gbps applications. The PCB material is replaced by the Panasonic MEGTRON6. The revised MTx+ is tested at 25 Gbps and the eye-diagram shows a mask margin of 22 %.
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We present the design and test results of a Drivers and Limiting AmplifierS ASIC operating at 10 Gbps (DLAS10) and three Miniature Optical Transmitter/Receiver/Transceiver modules (MTx+, MRx+, and MTRx+) based on DLAS10. DLAS10 can drive two Transmitter Optical Sub-Assemblies (TOSAs) of Vertical Cavity Surface Emitting Lasers (VCSELs), receive the signals from two Receiver Optical Sub-Assemblies (ROSAs) that have no embedded limiting amplifiers, or drive a VCSEL TOSA and receive the signal from a ROSA, respectively. Each channel of DLAS10 consists of an input Continuous Time Linear Equalizer (CTLE), a four-stage limiting amplifier (LA), and an output driver. The LA amplifies the signals of variable levels to a stable swing. The output driver drives VCSELs or impedance-controlled traces. DLAS10 is fabricated in a 65 nm CMOS technology. The die is 1 mm x 1 mm. DLAS10 is packaged in a 4 mm x 4 mm 24-pin quad-flat no-leads (QFN) package. DLAS10 has been tested in MTx+, MRx+, and MTRx+ modules. Both measured optical and electrical eye diagrams pass the 10 Gbps eye mask test. The input electrical sensitivity is 40 mVp-p, while the input optical sensitivity is -12 dBm. The total jitter of MRx+ is 29 ps (P-P) with a random jitter of 1.6 ps (RMS) and a deterministic jitter of 9.9 ps. Each MTx+/MTRx+ module consumes 82 mW/ch and 174 mW/ch, respectively.
We present a dual-channel optical transmitter (MTx+)/transceiver (MTRx+) for the front-end readout electronics of high-energy physics experiments. MTx+ utilizes two Transmitter Optical Sub-Assemblies (TOSAs) and MTRx+ utilizes a TOSA and a Receiver Optical Sub-Assemblies (ROSA). Both MTx+ and MTRx+ receive multimode fibers with standard Lucent Connectors (LCs) as the optical interface and can be panel or board mounted to a motherboard with a standard Enhanced Small Form-factor Pluggable (SFP+) connector as the electrical interface. MTx+ and MTRx+ employ a dual-channel Vertical-Cavity Surface-Emitting Laser (VCSEL) driver ASIC called LOCld65, which brings the transmitting data rate up to 14 Gbps per channel. MTx+ and MTRx+ have been tested to survive 4.9 kGy(SiO2).
We present the design principle and test results of a data transmitting ASIC, GBS20, for particle physics experiments. The goal of GBS20 will be an ASIC that employs two serializers each from the 10.24 Gbps lpGBT SerDes, sharing the PLL also from lpGBT. A PAM4 encoder plus a VCSEL driver will be implemented in the same die to use the same clock system, eliminating the need of CDRs in the PAM4 encoder. This way the transmitter module, GBT20, developed using the GBS20 ASIC, will have the exact lpGBT data interface and transmission protocol, with an output up to 20.48 Gbps over one fiber. With PAM4 embedded FPGAs at the receiving end, GBT20 will halve the fibers needed in a system and better use the input bandwidth of the FPGA. A prototype, GBS20v0 is fabricated using a commercial 65 nm CMOS technology. This prototype has two serializers and a PAM4 encoder sharing the lpGBT PLL, but no user data input. An internal PRBS generator provides data to the serializers. GBS20v0 is tested barely up to 20.48 Gbps. With lessons learned from this prototype, we are designing the second prototype, GBS20v1, that will have 16 user data input channels each at 1.28 Gbps. We present the design concept of the GBS20 ASIC and the GBT20 module, the preliminary test results, and lessons learned from GBS20v0 and the design of GBS20v1 which will be not only a test chip but also a user chip with 16 input data channels.
CMOS pixel sensors (CPS) represent a novel technological approach to building charged particle detectors. CMOS processes allow to integrate a sensing volume and readout electronics in a single silicon die allowing to build sensors with a small pixel pitch ($sim 20 mu m$) and low material budget ($sim 0.2-0.3% X_0$) per layer. These characteristics make CPS an attractive option for vertexing and tracking systems of high energy physics experiments. Moreover, thanks to the mass production industrial CMOS processes used for the manufacturing of CPS the fabrication construction cost can be significantly reduced in comparison to more standard semiconductor technologies. However, the attainable performance level of the CPS in terms of radiation hardness and readout speed is mostly determined by the fabrication parameters of the CMOS processes available on the market rather than by the CPS intrinsic potential. The permanent evolution of commercial CMOS processes towards smaller feature sizes and high resistivity epitaxial layers leads to the better radiation hardness and allows the implementation of accelerated readout circuits. The TowerJazz $0.18 mu m$ CMOS process being one of the most relevant examples recently became of interest for several future detector projects. The most imminent of these project is an upgrade of the Inner Tracking System (ITS) of the ALICE detector at LHC. It will be followed by the Micro-Vertex Detector (MVD) of the CBM experiment at FAIR. Other experiments like ILD consider CPS as one of the viable options for flavour tagging and tracking sub-systems.
Interest in many-core architectures applied to real time selections is growing in High Energy Physics (HEP) experiments. In this paper we describe performance measurements of many-core devices when applied to a typical HEP online task: the selection of events based on the trajectories of charged particles. We use as benchmark a scaled-up version of the algorithm used at CDF experiment at Tevatron for online track reconstruction - the SVT algorithm - as a realistic test-case for low-latency trigger systems using new computing architectures for LHC experiment. We examine the complexity/performance trade-off in porting existing serial algorithms to many-core devices. We measure performance of different architectures (Intel Xeon Phi and AMD GPUs, in addition to NVidia GPUs) and different software environments (OpenCL, in addition to NVidia CUDA). Measurements of both data processing and data transfer latency are shown, considering different I/O strategies to/from the many-core devices.
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