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Register a new userA TOSA/ROSA-Based Optical Transmitter (MTx+)/Transceiver (MTRx+) for High-Energy Physics Experiments
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We present a dual-channel optical transmitter (MTx+)/transceiver (MTRx+) for the front-end readout electronics of high-energy physics experiments. MTx+ utilizes two Transmitter Optical Sub-Assemblies (TOSAs) and MTRx+ utilizes a TOSA and a Receiver Optical Sub-Assemblies (ROSA). Both MTx+ and MTRx+ receive multimode fibers with standard Lucent Connectors (LCs) as the optical interface and can be panel or board mounted to a motherboard with a standard Enhanced Small Form-factor Pluggable (SFP+) connector as the electrical interface. MTx+ and MTRx+ employ a dual-channel Vertical-Cavity Surface-Emitting Laser (VCSEL) driver ASIC called LOCld65, which brings the transmitting data rate up to 14 Gbps per channel. MTx+ and MTRx+ have been tested to survive 4.9 kGy(SiO2).
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We report the development of a mid-board, TOSA and ROSA based miniature dual channel optical transmitter (MTx) and a transceiver (MTRx). The design transmission data rate is 5.12 Gbps per channel and receiving data rate 4.8 Gbps. MTx and MTRx are only 6 mm tall and are electrically and optically pluggable. Although the fiber TOSA/ROSA coupling is through a custom latch, the fiber uses the standard LC ferrule, flange and spring. Light coupling is ensured by the TOSA and ROSA with the LC coupling mechanism. With the dual channel serializer LOCx2 sits under MTx, one achieves high data transmission with a small PCB footprint, and enjoys the reliability of the hermetically packaged TOSA. MTx and MTRx are designed for detector front-end readout of the ATLAS Liquid Argon Calorimeter (LAr) trigger upgrade.
Development of optical links with 850 nm multi-mode vertical-cavity surface-emitting lasers (VCSELs) has advanced to 25 Gbps in speed. For applications in high-energy experiments, the transceivers are required to be tolerant in radiation and particle fields. We report on prototyping of a miniature transmitter named MTx+, which is developed for high speed transmission with the dual-channel laser driver LOCld65 and 850 nm VCSELs packaged in TOSA format. The LOCld65 is fabricated in the TSMC 65 nm process and is packaged in the QFN-40 for assembly. The MTx+ modules and test kits were first made with PCB and components qualified for 10 Gbps applications, and were tested for achieving 14 Gbps. The data transfer rate of the MTx+ module is investigated further for the speed of up to 25 Gbps. The LOCld65 is examined with post-layout simulation and the module design upgraded with components including the TOSA qualified for 25 Gbps applications. The PCB material is replaced by the Panasonic MEGTRON6. The revised MTx+ is tested at 25 Gbps and the eye-diagram shows a mask margin of 22 %.
As a concern with the reliability, bandwidth and mass of future optical links in LHC experiments, we are investigating CW lasers and light modulators as an alternative to VCSELs. These links will be particularly useful if they utilize light modulators which are very small, low power, high bandwidth, and are very radiation hard. We have constructed a test system with 3 such links, each operating at 10 Gb/s. We present the quality of these links (jitter, rise and fall time, BER) and eye mask margins (10GbE) for 3 different types of modulators: LiNbO3-based, InP-based, and Si-based. We present the results of radiation hardness measurements with up to ~1012 protons/cm2 and ~65 krad total ionizing dose (TID), confirming no single event effects (SEE) at 10 Gb/s with either of the 3 types of modulators. These optical links will be an integral part of intelligent tracking systems at various scales from coupled sensors through intra-module and off detector communication. We have used a Si-based photonic transceiver to build a complete 40 Gb/s bi-directional link (10 Gb/s in each of four fibers) for a 100m run and have characterized it to compare with standard VCSEL-based optical links. Some future developments of optical modulator-based high bandwidth optical readout systems, and applications based on both fiber and free space data links, such as local triggering and data readout and trigger-clock distribution, are also discussed.
CMOS pixel sensors (CPS) represent a novel technological approach to building charged particle detectors. CMOS processes allow to integrate a sensing volume and readout electronics in a single silicon die allowing to build sensors with a small pixel pitch ($sim 20 mu m$) and low material budget ($sim 0.2-0.3% X_0$) per layer. These characteristics make CPS an attractive option for vertexing and tracking systems of high energy physics experiments. Moreover, thanks to the mass production industrial CMOS processes used for the manufacturing of CPS the fabrication construction cost can be significantly reduced in comparison to more standard semiconductor technologies. However, the attainable performance level of the CPS in terms of radiation hardness and readout speed is mostly determined by the fabrication parameters of the CMOS processes available on the market rather than by the CPS intrinsic potential. The permanent evolution of commercial CMOS processes towards smaller feature sizes and high resistivity epitaxial layers leads to the better radiation hardness and allows the implementation of accelerated readout circuits. The TowerJazz $0.18 mu m$ CMOS process being one of the most relevant examples recently became of interest for several future detector projects. The most imminent of these project is an upgrade of the Inner Tracking System (ITS) of the ALICE detector at LHC. It will be followed by the Micro-Vertex Detector (MVD) of the CBM experiment at FAIR. Other experiments like ILD consider CPS as one of the viable options for flavour tagging and tracking sub-systems.
We present the design and test results of a Drivers and Limiting AmplifierS ASIC operating at 10 Gbps (DLAS10) and three Miniature Optical Transmitter/Receiver/Transceiver modules (MTx+, MRx+, and MTRx+) based on DLAS10. DLAS10 can drive two Transmitter Optical Sub-Assemblies (TOSAs) of Vertical Cavity Surface Emitting Lasers (VCSELs), receive the signals from two Receiver Optical Sub-Assemblies (ROSAs) that have no embedded limiting amplifiers, or drive a VCSEL TOSA and receive the signal from a ROSA, respectively. Each channel of DLAS10 consists of an input Continuous Time Linear Equalizer (CTLE), a four-stage limiting amplifier (LA), and an output driver. The LA amplifies the signals of variable levels to a stable swing. The output driver drives VCSELs or impedance-controlled traces. DLAS10 is fabricated in a 65 nm CMOS technology. The die is 1 mm x 1 mm. DLAS10 is packaged in a 4 mm x 4 mm 24-pin quad-flat no-leads (QFN) package. DLAS10 has been tested in MTx+, MRx+, and MTRx+ modules. Both measured optical and electrical eye diagrams pass the 10 Gbps eye mask test. The input electrical sensitivity is 40 mVp-p, while the input optical sensitivity is -12 dBm. The total jitter of MRx+ is 29 ps (P-P) with a random jitter of 1.6 ps (RMS) and a deterministic jitter of 9.9 ps. Each MTx+/MTRx+ module consumes 82 mW/ch and 174 mW/ch, respectively.
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