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Register a new userOptimization of efficiency and energy density of passive micro fuel cells and galvanic hydrogen generators
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Publication date
2008
fields
Informatics Engineering
and research's language is
English
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A PEM micro fuel cell system is described which is based on self-breathing PEM micro fuel cells in the power range between 1 mW and 1W. Hydrogen is supplied with on-demand hydrogen production with help of a galvanic cell, that produces hydrogen when Zn reacts with water. The system can be used as a battery replacement for low power applications and has the potential to improve the run time of autonomous systems. The efficiency has been investigated as function of fuel cell construction and tested for several load profiles.
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Micro-solid oxide fuel cells based on thin films have strong potential for use in portable power devices. However, devices based on silicon substrates typically involve thin-film metallic electrodes which are unstable at high temperatures. Devices based on bulk metal substrates overcome these limitations, though performance is hindered by the challenge of growing state-of-the-art epitaxial materials on metals. Here, we demonstrate for the first time the growth of epitaxial cathode materials on metal substrates (stainless steel) commercially supplied with epitaxial electrolyte layers (1.5 {um (Y2O3)0.15(ZrO2)0.85 (YSZ) + 50 nm CeO2). We create epitaxial mesoporous cathodes of (La0.60Sr0.40)0.95Co0.20Fe0.80O3 (LSCF) on the substrate by growing LSCF/MgO vertically aligned nanocomposite films by pulsed laser deposition, followed by selectively etching out the MgO. To enable valid comparison with the literature, the cathodes are also grown on single-crystal substrates, confirming state-of-the-art performance with an area specific resistance of 100ohmegacm2 at 500dC and activation energy down to 0.97 eV. The work marks an important step toward the commercialization of high-performance micro-solid oxide fuel cells for portable power applications.
The present study presents a new micro electromagnetic actuator utilizing a PDMS membrane with a magnet. The actuator is integrated with micro coils to electromagnetically actuate the membrane and results in a large deflection. The micro electromagnetic actuator proposed in this study is easily fabricated and is readily integrated with existing bio-medical chips due to its planar structure.
Multilayered ceramic substrates with embedded micro patterns are becoming increasingly important, for example, in harsh environment electronics and microfluidic devices. Fabrication of these embedded micro patterns, such as micro channels, cavities and vias, is a challenge. This study focuses on the process of patterning micro features on ceramic green substrates using micro embossing. A ceramic green tape that possessed near-zero shrinkage in the x-y plane was used, six layers of which were laminated as the embossing substrate. The process parameters that impact on the pattern fidelity were investigated and optimized in this study. Micro features with line-width as small as several micrometers were formed on the ceramic green substrates. The dynamic thermo-mechanical analysis indicated that extending the holding time at certain temperature range would harden the green substrates with little effect on improving the embossing fidelity. Ceramic substrates with embossed micro patterns were obtain d after co-firing. The embedded micro channels were also obtained by laminating the green tapes on the embossed substrates.
Spin Transfer Torque MRAMs are attractive due to their non-volatility, high density and zero leakage. However, STT-MRAMs suffer from poor reliability due to shared read and write paths. Additionally, conflicting requirements for data retention and write-ability (both related to the energy barrier height of the magnet) makes design more challenging. Furthermore, the energy barrier height depends on the physical dimensions of the free layer. Any variations in the dimensions of the free layer lead to variations in the energy barrier height. In order to address poor reliability of STT-MRAMs, usage of Error Correcting Codes (ECC) have been proposed. Unlike traditional CMOS memory technologies, ECC is expected to correct both soft and hard errors in STT_MRAMs. To achieve acceptable yield with low write power, stronger ECC is required, resulting in increased number of encoded bits and degraded memory efficiency. In this paper, we propose Failure aware ECC (FaECC), which masks permanent faults while maintaining the same correction capability for soft errors without increased encoded bits. Furthermore, we investigate the impact of process variations on run-time reliability of STT-MRAMs. We provide an analysis on the impact of process variations on the life-time of the free layer and retention failures. In order to analyze the effectiveness of our methodology, we developed a cross-layer simulation framework that consists of device, circuit and array level analysis of STT-MRAM memory arrays. Our results show that using FaECC relaxes the requirements on the energy barrier height, which reduces the write energy and results in smaller access transistor size and memory array area. Keywords: STT-MRAM, reliability, Error Correcting Codes, ECC, magnetic memory
A novel fabrication process, which uses wafer transfer and micro-electroplating technique, has been proposed and tested. In this paper, the effects of the diaphragm thickness and stress, the air-gap thickness, and the area ratio of acoustic holes to backplate on the sensitivity of the condenser microphone have been demonstrated since the performance of the microphone depends on these parameters. The microphone diaphragm has been designed with a diameter and thickness of 1.9 mm and 0.6 $mu$m, respectively, an air-gap thickness of 10 $mu$m, and a 24% area ratio of acoustic holes to backplate. To obtain a lower initial stress, the material used for the diaphragm is polyimide. The measured sensitivities of the microphone at the bias voltages of 24 V and 12 V are -45.3 and -50.2 dB/Pa (at 1 kHz), respectively. The fabricated microphone shows a flat frequency response extending to 20 kHz.
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