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Register a new userYield, Area and Energy Optimization in Stt-MRAMs using failure aware ECC
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Added by
Zoha Pajouhi
Publication date
2015
fields
Informatics Engineering
and research's language is
English
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Spin Transfer Torque MRAMs are attractive due to their non-volatility, high density and zero leakage. However, STT-MRAMs suffer from poor reliability due to shared read and write paths. Additionally, conflicting requirements for data retention and write-ability (both related to the energy barrier height of the magnet) makes design more challenging. Furthermore, the energy barrier height depends on the physical dimensions of the free layer. Any variations in the dimensions of the free layer lead to variations in the energy barrier height. In order to address poor reliability of STT-MRAMs, usage of Error Correcting Codes (ECC) have been proposed. Unlike traditional CMOS memory technologies, ECC is expected to correct both soft and hard errors in STT_MRAMs. To achieve acceptable yield with low write power, stronger ECC is required, resulting in increased number of encoded bits and degraded memory efficiency. In this paper, we propose Failure aware ECC (FaECC), which masks permanent faults while maintaining the same correction capability for soft errors without increased encoded bits. Furthermore, we investigate the impact of process variations on run-time reliability of STT-MRAMs. We provide an analysis on the impact of process variations on the life-time of the free layer and retention failures. In order to analyze the effectiveness of our methodology, we developed a cross-layer simulation framework that consists of device, circuit and array level analysis of STT-MRAM memory arrays. Our results show that using FaECC relaxes the requirements on the energy barrier height, which reduces the write energy and results in smaller access transistor size and memory array area. Keywords: STT-MRAM, reliability, Error Correcting Codes, ECC, magnetic memory
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As one of the most promising emerging non-volatile memory (NVM) technologies, spin-transfer torque magnetic random access memory (STT-MRAM) has attracted significant research attention due to several features such as high density, zero standby leakage, and nearly unlimited endurance. However, a high-quality test solution is required prior to the commercialization of STT-MRAM. In this paper, we present all STT-MRAM failure mechanisms: manufacturing defects, extreme process variations, magnetic coupling, STT-switching stochasticity, and thermal fluctuation. The resultant fault models including permanent faults and transient faults are classified and discussed. Moreover, the limited test algorithms and design-for-testability (DfT) designs proposed in the literature are also covered. It is clear that test solutions for STT-MRAMs are far from well established yet, especially when considering a defective part per billion (DPPB) level requirement. We present the main challenges on the STT-MRAM testing topic at three levels: failure mechanisms, fault modeling, and test/DfT designs.
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