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Register a new userReadout of GEM Detectors Using the Medipix2 CMOS Pixel Chip
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We have operated a Medipix2 CMOS readout chip, with amplifying, shaping and charge discriminating front-end electronics integrated on the pixel-level, as a highly segmented direct charge collecting anode in a three-stage gas electron multiplier (Triple-GEM) to detect the ionization from $^{55}$Fe X-rays and electrons from $^{106}$Ru. The device allows to perform moderate energy spectroscopy measurements (20 % FWHM at 5.9 keV $X$-rays) using only digital readout and two discriminator thresholds. Being a truly 2D-detector, it allows to observe individual clusters of minimum ionizing charged particles in $Ar/CO_2$ (70:30) and $He/CO_2$ (70:30) mixtures and to achieve excellent spatial resolution for position reconstruction of primary clusters down to $sim 50 mu m$, based on the binary centroid determination method.
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This paper describes an iterative method of per-pixel energy calibration of hybrid pixel detectors with GaAs:Cr sensor and Timepix readout chip. A convolution of precisely measured spectra of characteristic X-rays of different metals with the resolution and the efficiency of the pixel detector is used for the calibration. The energy resolution of the detector is also measured during the calibration. The use of per-pixel calibration allows to achieve a good energy resolution of the Timepix detector with GaAs:Cr sensor: 8% and 13% at 60 keV and 20 keV, respectively.
The MuPix7 chip is a monolithic HV-CMOS pixel chip, thinned down to 50 mu m. It provides continuous self-triggered, non-shuttered readout at rates up to 30 Mhits/chip of 3x3 mm^2 active area and a pixel size of 103x80 mu m^2. The hit efficiency depends on the chosen working point. Settings with a power consumption of 300 mW/cm^2 allow for a hit efficiency >99.5%. A time resolution of 14.2 ns (Gaussian sigma) is achieved. Latest results from 2016 test beam campaigns are shown.
The use of CMOS Pixel Sensors (CPS) for high resolution and low material vertex detectors has been validated with the 2014 and 2015 physics runs of the STAR-PXL detector at RHIC/BNL. This opens the door to the use of CPS for inner tracking devices, with 10-100 times larger sensitive area, which require therefore a sensor design privileging power saving, response uniformity and robustness. The 350 nm CMOS technology used for the STAR-PXL sensors was considered as too poorly suited to upcoming applications like the upgraded ALICE Inner Tracking System (ITS), which requires sensors with one order of magnitude improvement on readout speed and improved radiation tolerance. This triggered the exploration of a deeper sub-micron CMOS technology, Tower-Jazz 180 nm, for the design of a CPS well adapted for the new ALICE-ITS running conditions. This paper reports the R&D results for the conception of a CPS well adapted for the ALICE-ITS.
Many experiments are currently using or proposing to use large area GEM foils in their detectors, which is creating a need for commercially available GEM foils. Currently CERN is the only main distributor of large GEM foils, however with the growing interest in GEM technology keeping up with the increasing demand for GEMs will be difficult. Thus the commercialization of GEMs up to 50 $times$ 50 cm$^2$ has been established by Tech-Etch Inc. of Plymouth, MA, USA using the single-mask technique. The electrical performance and optical quality of the single-mask GEM foils have been found to be on par with those produced by CERN. The next critical step towards validating the Tech-Etch single-mask GEM foils is to test their performance under physics conditions. These measurements will allow us to quantify and compare the gain and efficiency of the detector to other triple-GEM detectors. This will be done by constructing several single-mask triple-GEM detectors, using foils manufactured by Tech-Etch, which follow the design used by the STAR Forward GEM Tracker (FGT). These detectors will investigate ways in which to further decrease the material budget and increase the efficiency of the detector by incorporating perforated Kapton spacer rings rather than G10 spacing grids to reduce the dead area of the detector. The materials and tooling needed to assemble the triple-GEM detectors have been acquired. The GEM foils have been electrically tested, and a handful have been optically scanned. We found these results to be consistent with GEM foils produced by CERN. With the success of these initial tests, construction of the triple-GEM detectors is now under way.
We present the implementation and verification of an in-pixel automatic threshold calibration circuit for the CMS Endcap Timing Layer (ETL) in the High-Luminosity LHC upgrade. The discriminator threshold of the ETL readout chip (ETROC) needs to be calibrated regularly to mitigate the circuit baseline change. Traditional methods need a lot of communication through a slow control system hence are time-consuming. This paper describes an in-pixel automatic scheme with improvements in operating time and usability. In this scheme, a sample-accumulation circuit is used to measure the average discriminator output. A binary successive approximation and linear combination scan are applied to find the equivalent baseline. The actual calibration procedure has been first implemented in FPGA firmware and tested with the ETROC front-end prototype chip (ETROC0). The calibration circuit has been implemented with Triple Modular Redundancy (TMR) and verified with Single Event Effects (SEEs) simulation. A complete calibration process lasts 35 ms with a 40 MHz clock. In the worst case, the dynamic and static power consumption are estimated to be 300 uW and 10.4 uW, respectively. The circuit design, implemented in a 65 CMOS technology, will be integrated into ETROC2, the next iteration of the ETROC with a 16x16 pixel matrix.
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