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Hybrid Pixel Detector Development for the Linear Collider Vertex Tracker

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 Added by Marco Battaglia
 Publication date 2000
  fields
and research's language is English




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In order to fully exploit the physics potential of the future high energy e+e- linear collider, a Vertex Tracker able to provide particle track extrapolation with very high resolution is needed. Hybrid Si pixel sensors are an attractive technology due to their fast read-out capabilities and radiation hardness. A novel pixel detector layout with interleaved cells has been developed to improve the single point resolution. Results of the characterisation of the first processed prototypes by electrostatic measurements and charge collection studies are discussed.



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158 - M. Battaglia , R. Orava , K. Tammi 1999
In order to fully exploit the physics potential of a future high energy e+e- linear collider, a Vertex Tracker, providing high resolution track reconstruction, is required. Hybrid Silicon pixel sensors are an attractive option, for the sensor technology, due to their read-out speed and radiation hardness, favoured in the high rate environment of the TESLA e+e- linear collider design but have been so far limited by the achievable single point space resolution. In this paper, a conceptual design of the TESLA Vertex Tracker, based on a novel layout of hybrid pixel sensors with interleaved cells to improve their spatial resolution, is presented.
398 - T. G. White 2011
Using the simulation framework of the SiD detector to study the Higgs -> mumu decay channel showed a considerable gain in signal significance could be achieved through an increase in charged particle momentum resolution. However more detailed simulations of theZ -> mumu decay channel demonstrated that significant improvement in the resolution could not be achieved through an increase in tracker granularity. Conversely detector stability studies into missing/dead vertex layers using longer lived particles displayed an increase in track resolution. The existing 9.15 cm x 25 {mu}m silicon strip geometry was replaced with 100 x 100 micrometers silicon pixels improving secondary vertex resolution by a factor of 100. Study into highly collimated events through the use of dense jets showed that momentum resolution can be increased by a factor of 2, greatly improving signal significance but requiring a reduction in pixel size to 25 micrometers. An upgrade of the tracker granularity from the 9.15 cm strips to micrometer sized pixels requires an increase in number and complexity of sensor channels yet provides only a small improvement in the majority of linear collider physics.
83 - T.Naito , K. Ebihara , H.Hayano 2000
The rf distribution system for the linear collider requires stable x-band(11.424GHz) rf phase signal over 25km length. In order to realize the distribution system, a fiber optic link using a phase stabilized optical fiber was tested. The phase stabilized optical fiber has been employed at LEP, KEKB, etc.. This paper describes the hardware system and result of the preliminary test of the feed back system for stabilization of the phase change.
The EUDET-project was launched to create an infrastructure for developing and testing new and advanced detector technologies to be used at a future linear collider. The aim was to make possible experimentation and analysis of data for institutes, which otherwise could not be realized due to lack of resources. The infrastructure comprised an analysis and software network, and instrumentation infrastructures for tracking detectors as well as for calorimetry.
CMOS Pixel Sensors are making steady progress towards the specifications of the ILD vertex detector. Recent developments are summarised, which show that these devices are close to comply with all major requirements, in particular the read-out speed needed to cope with the beam related background. This achievement is grounded on the double- sided ladder concept, which allows combining signals generated by a single particle in two different sensors, one devoted to spatial resolution and the other to time stamp, both assembled on the same mechanical support. The status of the development is overviewed as well as the plans to finalise it using an advanced CMOS process.
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