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Register a new userReal-time monitoring of stress evolution during thin film growth by in situ substrate curvature measurement
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Strain engineering is the art of inducing controlled lattice distortions in a material to modify specific physicochemical properties. Strain engineering is applied for basic fundamental studies of physics and chemistry of solids but also for device fabrication through the development of materials with new functionalities. Thin films are one of the most important tools for strain engineering. Thin films can in fact develop large strain due to the crystalline constrains at the interface with the substrate and/or as the result of specific morphological features that can be selected by an appropriate tuning of the deposition parameters. Within this context, the in situ measurement of the substrate curvature is a powerful diagnostic tool allowing a real time monitoring of the stress state of the growing film. This manuscript reviews a few recent applications of this technique and presents new measurements that point out the great potentials of the substrate curvature measurement in strain engineering. Our study also shows how, due to the high sensitivity of the technique, the correct interpretation of the results can be in certain cases not trivial and require complementary characterizations and an accurate knowledge of the physicochemical properties of the materials under investigation.
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Here, we study the role of stress state and stress gradient in whisker growth in Sn coatings electrodeposited on brass. The bulk stress in Sn coatings was measured using a laser-optics based curvature setup, whereas glancing angle X-ray diffraction was employed to quantify the surface stress; this also allowed studying role of out-of-plane stress gradient in whisker growth. Both bulk stress and surface stress in Sn coating evolved with time, wherein both were compressive immediately after the deposition, and thereafter while the bulk stress monotonically became more compressive and subsequently saturated with aging at room temperature, the stress near the surface of the Sn coating continually became more tensile with aging. These opposing evolutionary behaviors of bulk and surface stresses readily established a negative out-of-plane stress gradient, required for spontaneous growth of whiskers. The importance of out-of-plane stress gradient was also validated by externally imposing widely different stress states and stress gradients in Sn coatings using a 3-point bending apparatus. It was consistently observed that whisker growth was more in the coatings under external tensile stress, however, with higher negative out-of-plane stress gradient. The results conclusively indicate the critical role of negative out-of-plane stress gradient on whisker growth, as compared to only the nature (i.e., sign and magnitude) of stress.
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