No Arabic abstract
We present the detailed study of the digital readout of Topmetal-II- CMOS pixel direct charge sensor. Topmetal-II- is an integrated sensor with an array of 72X72 pixels each capable of directly collecting external charge through exposed metal electrodes in the topmost metal layer. In addition to the time-shared multiplexing readout of the analog output from Charge Sensitive Amplifiers in each pixel, hits are also generated through comparators with individually DAC settable thresholds in each pixel. The hits are read out via a column-based priority logic structure, retaining both hit location and time information. The in-array column-based priority logic is fully combinational hence there is no clock distributed in the pixel array. Sequential logic and clock are placed on the peripheral of the array. We studied the detailed working behavior and performance of this readout, and demonstrated its potential in imaging applications.
We report the design and characterization of a CMOS pixel direct charge sensor, Topmetal-II-, fabricated in a standard 0.35um CMOS Integrated Circuit process. The sensor utilizes exposed metal patches on top of each pixel to directly collect charge. Each pixel contains a low-noise charge-sensitive preamplifier to establish the analog signal and a discriminator with tunable threshold to generate hits. The analog signal from each pixel is accessible through time-shared multiplexing over the entire array. Hits are read out digitally through a column-based priority logic structure. Tests show that the sensor achieved a <15e- analog noise and a 200e- minimum threshold for digital readout per pixel. The sensor is capable of detecting both electrons and ions drifting in gas. These characteristics enable its use as the charge readout device in future Time Projection Chambers without gaseous gain mechanism, which has unique advantages in low background and low rate-density experiments.
We have operated a Medipix2 CMOS readout chip, with amplifying, shaping and charge discriminating front-end electronics integrated on the pixel-level, as a highly segmented direct charge collecting anode in a three-stage gas electron multiplier (Triple-GEM) to detect the ionization from $^{55}$Fe X-rays and electrons from $^{106}$Ru. The device allows to perform moderate energy spectroscopy measurements (20 % FWHM at 5.9 keV $X$-rays) using only digital readout and two discriminator thresholds. Being a truly 2D-detector, it allows to observe individual clusters of minimum ionizing charged particles in $Ar/CO_2$ (70:30) and $He/CO_2$ (70:30) mixtures and to achieve excellent spatial resolution for position reconstruction of primary clusters down to $sim 50 mu m$, based on the binary centroid determination method.
The Mu3e experiment is searching for the charged lepton flavour violating decay $ mu^+rightarrow e^+ e^- e^+ $, aiming for an ultimate sensitivity of one in $10^{16}$ decays. In an environment of up to $10^9$ muon decays per second the detector needs to provide precise vertex, time and momentum information to suppress accidental and physics background. The detector consists of cylindrical layers of $50, mutext{m}$ thin High Voltage Monolithic Active Pixel Sensors (HV-MAPS) placed in a $1,text{T}$ magnetic field. The measurement of the trajectories of the decay particles allows for a precise vertex and momentum reconstruction. Additional layers of fast scintillating fibre and tile detectors provide sub-nanosecond time resolution. The MuPix8 chip is the first large scale prototype, proving the scalability of the HV-MAPS technology. It is produced in the AMS aH18 $180, text{nm}$ HV-CMOS process. It consists of three sub-matrices, each providing an untriggered datastream of more than $10,text{MHits}/text{s}$. The latest results from laboratory and testbeam characterisation are presented, showing an excellent performance with efficiencies $>99.6,text{%}$ and a time resolution better than $10, text{ns}$ achieved with time walk correction.
We propose a novel charge sensing concept for high-pressure Time Projection Chamber (TPC) to search for Neutrinoless Double-Beta Decay (NLDBD) with ton-scale isotope mass and beyond. A meter-sized plane, tiled with an array of CMOS integrated sensors called Topmetal that directly collect charge without gas avalanche gain, is to be deployed into a high-pressure gaseous TPC with working gases containing suitable NLDBD candidate isotopes such as Xe-136 and Se-82. The Topmetal sensor has an electronic noise <30 e- per pixel, which allows the detector to reach <1% FWHM energy resolution at the NLDBD Q-value for both Xe-136 and 82SeF6 gases by measuring ionization charges alone. The elimination of charge avalanche gain allows the direct sensing of slow-drifting ions, which enables the use of highly electronegative gas SeF6 in which free electrons do not exist. It supports the swapping of working gases without hardware modification, which is a unique way to validate signals against radioactive backgrounds. Since the sensor manufacturing and plane assembling could leverage unaltered industrial mass-production processes, stability, uniformity, scalability, and cost-effectiveness that are required for ton-scale experiments could all be reached. The strengths of TPC such as 3D ionization tracking and decay daughter tagging are retained. This development could lead to a competitive NLDBD experiment at and above ton-scale. The conceptual considerations, simulations, and initial prototyping are discussed.
We present a study of a CMOS test sensor which has been designed, fabricated and characterised to investigate the parameters required for a binary readout electromagnetic calorimeter. The sensors were fabricated with several enhancements in addition to standard CMOS processing. Detailed simulations and experimental results of the performance of the sensor are presented. The sensor and pixels are shown to behave in accordance with expectations and the processing enhancements are found to be essential to achieve the performance required.