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Register a new userControlling the thickness of Josephson tunnel barriers with atomic layer deposition
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Atomic Layer Deposition (ALD) is a promising technique for producing Josephson junctions (JJs) with lower defect densities for qubit applications. A key problem with using ALD for JJs is the interfacial layer (IL) that develops underneath the tunnel barrier. An IL up to 2 nm forms between ALD Al2O3 and Al. However, the IL thickness is unknown for ALD films less 1 nm. In this work, Nb-Al-ALD-Al2O3-Nb trilayers with tunnel barriers from 0.6 - 1.6 nm were grown in situ. Nb-Al-AlOx-Nb JJs with thermally oxidized tunnel barrier were produced for reference. RN was obtained using a four-point method at 300 K. JC, and its dependence on barrier thickness, was calculated from the Ambegaokar-Baratoff formula. The Al surface was modeled using ab initio molecular dynamics to study the nucleation of Al2O3 on Al. Current voltage characteristics were taken at 4 K to corroborate the room temperature measurements. Together, these results suggest that ALD may be used to grow an ultrathin, uniform tunnel barrier with controllable tunnel resistance and JC, but a thin IL develops during the nucleation stage of ALD growth that may disqualify Al as a suitable wetting layer for ALD JJ based qubits.
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Josephson tunnel junctions with the strong ferromagnetic alloy $Fe_{0.75}Co_{0.25}$ as the barrier material were studied. The junctions were prepared with high quality down to a thickness range of a few monolayers of Fe-Co. An oscillation length of $xi_{F2}approx 0.79:{rm {nm}}$ between 0 and $pi$-Josephson phase coupling and a very short decay length $xi_{F1}approx 0.22:{rm {nm}}$ for the amplitude of the superconducting pair wave function in the Fe-Co layer were determined. The rapid damping of the pair wave function inside the Fe-Co layer is caused by the strong ferromagnetic exchange field and additional magnetic pair breaking scattering. Josephson junctions with Fe-Co barriers show a significantly increased tendency towards magnetic remanence and flux trapping for larger thicknesses $d_{F}$.
A method to treat the surface of Nb is described which potentially can improve the performance of superconducting RF cavities. We present tunneling and x-ray photoemission spectroscopy (XPS) measurements at the surface of cavity-grade niobium samples coated with a 3 nm alumina overlayer deposited by Atomic Layer Deposition (ALD). The coated samples baked in ultra high vacuum (UHV) at low temperature reveal at first degraded superconducting surface. However, at temperatures above 450C, the tunneling conductance curves show significant improvements of the superconducting density of states (DOS) compared with untreated surfaces.
Ultrathin dielectric tunneling barriers are critical to Josephson junction (JJ) based superconducting quantum bits (qubits). However, the prevailing technique of thermally oxidizing aluminum via oxygen diffusion produces problematic defects, such as oxygen vacancies, which are believed to be a primary source of the two-level fluctuators and contribute to the decoherence of the qubits. Development of alternative approaches for improved tunneling barriers becomes urgent and imperative. Atomic Layer Deposition (ALD) of aluminum oxide (Al2O3) is a promising alternative to resolve the issue of oxygen vacancies in the Al2O3 tunneling barrier, and its self-limiting growth mechanism provides atomic-scale precision in tunneling barrier thickness control. A critical issue in ALD of Al2O3 on metals is the lack of hydroxyl groups on metal surface, which prevents nucleation of the trimethylaluminum (TMA). In this work, we explore modifications of the aluminum surface with water pulse exposures followed by TMA pulse exposures to assess the feasibility of ALD as a viable technique for JJ qubits. ALD Al2O3 films from 40 angstroms to 100 angstoms were grown on 1.4 angstroms to 500 angstroms of Al and were characterized with ellipsometry and atomic force microscopy. A growth rate of 1.2 angstroms/cycle was measured, and an interfacial layer (IL) was observed. Since the IL thickness depends on the availability of Al and saturated at 2 nm, choosing ultrathin Al wetting layers may lead to ultrathin ALD Al2O3 tunneling barriers.
We have studied the effect of deposition rate and layer thickness on the properties of epitaxial MgB2 thin films grown by hybrid physical-chemical vapor deposition on 4H-SiC substrates. The MgB2 film deposition rate depends linearly on the concentration of B2H6 in the inlet gas mixture. We found that the superconducting and normal-state properties of the MgB2 films are determined by the film thickness, not by the deposition rate. When the film thickness was increased, the transition temperature, Tc, increased and the residual resistivity, rho0, decreased. Above about 300 nm, a Tc of 41.8 K, a rho0 of 0.28 mikroOhm.cm, and a residual resistance ratio RRR of over 30 were obtained. These values represent the best MgB2 properties reported thus far.
In this paper, a method is presented to create and characterize mechanically robust, free standing, ultrathin, oxide films with controlled, nanometer-scale thickness using Atomic Layer Deposition (ALD) on graphene. Aluminum oxide films were deposited onto suspended graphene membranes using ALD. Subsequent etching of the graphene left pure aluminum oxide films only a few atoms in thickness. A pressurized blister test was used to determine that these ultrathin films have a Youngs modulus of 154 pm 13 GPa. This Youngs modulus is comparable to much thicker alumina ALD films. This behavior indicates that these ultrathin two-dimensional films have excellent mechanical integrity. The films are also impermeable to standard gases suggesting they are pinhole-free. These continuous ultrathin films are expected to enable new applications in fields such as thin film coatings, membranes and flexible electronics.
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