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It is demonstrated, by numerical simulations of a 2D assembly of polydisperse disks, that there exists a range (plateau) of coarse graining scales for which the stress tensor field in a granular solid is nearly resolution independent, thereby enabling an `objective definition of this field. Expectedly, it is not the mere size of the the system but the (related) magnitudes of the gradients that determine the widths of the plateaus. Ensemble averaging (even over `small ensembles) extends the widths of the plateaus to sub-particle scales. The fluctuations within the ensemble are studied as well. Both the response to homogeneous forcing and to an external compressive localized load (and gravity) are studied. Implications to small solid systems and constitutive relations are briefly discussed.
Many clays, soils, biological tissues, foods, and coatings are shrinkable, granular materials: they are composed of packed, hydrated grains that shrink when dried. In many cases, these packings crack during drying, critically hindering applications.
We experimentally investigate the response of a sheared granular medium in a Couette geometry. The apparatus exhibits the expected stick-slip motion and we probe it in the very intermittent regime resulting from low driving. Statistical analysis of t
Resonant x-ray reflectivity of the surface of the liquid phase of the Bi$_{43}$Sn$_{57}$ eutectic alloy reveals atomic-scale demixing extending over three near-surface atomic layers. Due to the absence of underlying atomic lattice which typically def
We study the local disorder in the deformation of amorphous materials by decomposing the particle displacements into a continuous, inhomogeneous field and the corresponding fluctuations. We compare these fields to the commonly used non-affine displac
Hydrated granular packings often crack into discrete clusters of grains when dried. Despite its ubiquity, accurate prediction of cracking remains elusive. Here, we elucidate the previously overlooked role of individual grain shrinkage---a feature com