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تسجيل مستخدم جديدInterplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films
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Germanosilicides, especially those formed on compressive substrates, are less stable than silicides against agglomeration. By studying the solid-state reaction of Ni thin film on strained Si0.8Ge0.2(001), we show that nickel germanosilicide is different from nickel silicide and nickel germanide in several respects: the grains are smaller and faceted, the groove angle is sharper, and dealloying takes place. The germanium out-diffusion creates a stress in the film which favors grooving and agglomeration.
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