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First study of small-cell 3D Silicon Pixel Detectors for the High Luminosity LHC

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 نشر من قبل Gervasio G\\'omez
 تاريخ النشر 2018
  مجال البحث فيزياء
والبحث باللغة English
 تأليف E. Curras




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A study of 3D pixel sensors of cell size 50 {mu}m x 50 {mu}m fabricated at IMB-CNM using double-sided n-on-p 3D technology is presented. Sensors were bump-bonded to the ROC4SENS readout chip. For the first time in such a small-pitch hybrid assembly, the sensor response to ionizing radiation in a test beam of 5.6 GeV electrons was studied. Results for non-irradiated sensors are presented, including efficiency, charge sharing, signal-to-noise, and resolution for different incidence angles.



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