Electric-field noise from ion-trap electrode surfaces can limit the fidelity of multiqubit entangling operations in trapped-ion quantum information processors and can give rise to systematic errors in trapped-ion optical clocks. The underlying mechan
ism for this noise is unknown, but it has been shown that the noise amplitude can be reduced by energetic ion bombardment, or ion milling, of the trap electrode surfaces. Using a single trapped $^{88}$Sr$^{+}$ ion as a sensor, we investigate the temperature dependence of this noise both before and after ex situ ion milling of the trap electrodes. Making measurements over a trap electrode temperature range of 4 K to 295 K in both sputtered niobium and electroplated gold traps, we see a marked change in the temperature scaling of the electric-field noise after ion milling: power-law behavior in untreated surfaces is transformed to Arrhenius behavior after treatment. The temperature scaling becomes material-dependent after treatment as well, strongly suggesting that different noise mechanisms are at work before and after ion milling. To constrain potential noise mechanisms, we measure the frequency dependence of the electric-field noise, as well as its dependence on ion-electrode distance, for niobium traps at room temperature both before and after ion milling. These scalings are unchanged by ion milling.
Surface-electrode (SE) rf traps are a promising approach to manufacturing complex ion-trap networks suitable for large-scale quantum information processing. In this paper we present analytical methods for modeling SE traps in the gapless plane approx
imation, and apply these methods to two particular classes of SE traps. For the SE ring trap we derive analytical expressions for the trap geometry and strength, and also calculate the depth in the absence of control fields. For translationally symmetric multipole configurations (analogs of the linear Paul trap), we derive analytical expressions for electrode geometry and strength. Further, we provide arbitrarily good approximations of the trap depth in the absence of static fields and identify the requirements for obtaining maximal depth. Lastly, we show that the depth of SE multipoles can be greatly influenced by control fields.
We report on single Barium ions confined in a near-infrared optical dipole trap for up to three seconds in absence of any radio-frequency fields. Additionally, the lifetime in a visible optical dipole trap is increased by two orders of magnitude as c
ompared to the state-of-the-art using an efficient repumping method. We characterize the state-dependent potentials and measure an upper bound for the heating rate in the near-infrared trap. These findings are beneficial for entering the regime of ultracold interaction in atom-ion ensembles exploiting bichromatic optical dipole traps. Long lifetimes and low scattering rates are essential to reach long coherence times for quantum simulations in optical lattices employing many ions, or ions and atoms.
We demonstrate trapping in a surface-electrode ion trap fabricated in a 90-nm CMOS (complementary metal-oxide-semiconductor) foundry process utilizing the top metal layer of the process for the trap electrodes. The process includes doped active regio
ns and metal interconnect layers, allowing for co-fabrication of standard CMOS circuitry as well as devices for optical control and measurement. With one of the interconnect layers defining a ground plane between the trap electrode layer and the p-type doped silicon substrate, ion loading is robust and trapping is stable. We measure a motional heating rate comparable to those seen in surface-electrode traps of similar size. This is the first demonstration of scalable quantum computing hardware, in any modality, utilizing a commercial CMOS process, and it opens the door to integration and co-fabrication of electronics and photonics for large-scale quantum processing in trapped-ion arrays.
The advent of microfabricated ion traps for the quantum information community has allowed research groups to build traps that incorporate an unprecedented number of trapping zones. However, as device complexity has grown, the number of digital-to-ana
log converter (DAC) channels needed to control these devices has grown as well, with some of the largest trap assemblies now requiring nearly one hundred DAC channels. Providing electrical connections for these channels into a vacuum chamber can be bulky and difficult to scale beyond the current numbers of trap electrodes. This paper reports on the development and testing of an in-vacuum DAC system that uses only 9 vacuum feedthrough connections to control a 78-electrode microfabricated ion trap. The system is characterized by trapping single and multiple $^{40}$Ca$^+$ ions. The measured axial mode stability, ion heating rates, and transport fidelities for a trapped ion are comparable to systems with external(air-side) commercial DACs.