Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a
function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sensors were bump bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.
We present measurements of the decays B+ -> X(3872) K+ and B0 -> X(3872) K0 with X(3872) -> Jpsi pi+ pi-. The data sample used, collected with the BABAR detector at the PEP-II e+e- asymmetric-energy storage ring, corresponds to 455 x 10^6 BBbar pairs
. Branching fraction measurements of BF(B+ -> X(3872) K+) x BF(X(3872) -> Jpsi pi+ pi-) = (8.4 +/- 1.5 +/- 0.7) x 10^{-6} and BF(B0 -> X(3872) K0) x BF(X(3872) -> Jpsi pi+ pi- = (3.5 +/- 1.9 +/- 0.4) x 10^{-6} are obtained. We set an upper limit on the natural width of the X(3872) of Gamma < 3.3 MeV/c^2 at the 90% confidence level.
