3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moores law scaling. 3D stacking promises potential gains in performance, power and cost but th
e actual magnitude of gains varies depending on end-application, technology choices and design. In this talk, we will discuss some key challenges associated with 3D design and how design-for-3D will require us to break traditional silos of micro-architecture, circuit/physical design and manufacturing technology to work across abstractions to enable the gains promised by 3D technologies.
Standard cell libraries are the foundation for the entire backend design and optimization flow in modern application-specific integrated circuit designs. At 7nm technology node and beyond, standard cell library design and optimization is becoming inc
reasingly difficult due to extremely complex design constraints, as described in the ASAP7 process design kit (PDK). Notable complexities include discrete transistor sizing due to FinFETs, complicated design rules from lithography and restrictive layout space from modern standard cell architectures. The design methodology presented in this paper enables efficient and high-quality standard cell library design and optimization with the ASAP7 PDK. The key techniques include exhaustive transistor sizing for cell timing optimization, transistor placement with generalized Euler paths and back-end design prototyping for library-level explorations.
As the feature size of semiconductor process further scales to sub-16nm technology node, triple patterning lithography (TPL) has been regarded one of the most promising lithography candidates. M1 and contact layers, which are usually deployed within
standard cells, are most critical and complex parts for modern digital designs. Traditional design flow that ignores TPL in early stages may limit the potential to resolve all the TPL conflicts. In this paper, we propose a coherent framework, including standard cell compliance and detailed placement to enable TPL friendly design. Considering TPL constraints during early design stages, such as standard cell compliance, improves the layout decomposability. With the pre-coloring solutions of standard cells, we present a TPL aware detailed placement, where the layout decomposition and placement can be resolved simultaneously. Our experimental results show that, with negligible impact on critical path delay, our framework can resolve the conflicts much more easily, compared with the traditional physical design flow and followed layout decomposition.
