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Register a new userCODIC: A Low-Cost Substrate for Enabling Custom In-DRAM Functionalities and Optimizations
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Added by
Lois Orosa
Publication date
2021
fields
Informatics Engineering
and research's language is
English
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DRAM is the dominant main memory technology used in modern computing systems. Computing systems implement a memory controller that interfaces with DRAM via DRAM commands. DRAM executes the given commands using internal components (e.g., access transistors, sense amplifiers) that are orchestrated by DRAM internal timings, which are fixed foreach DRAM command. Unfortunately, the use of fixed internal timings limits the types of operations that DRAM can perform and hinders the implementation of new functionalities and custom mechanisms that improve DRAM reliability, performance and energy. To overcome these limitations, we propose enabling programmable DRAM internal timings for controlling in-DRAM components. To this end, we design CODIC, a new low-cost DRAM substrate that enables fine-grained control over four previously fixed internal DRAM timings that are key to many DRAM operations. We implement CODIC with only minimal changes to the DRAM chip and the DDRx interface. To demonstrate the potential of CODIC, we propose two new CODIC-based security mechanisms that outperform state-of-the-art mechanisms in several ways: (1) a new DRAM Physical Unclonable Function (PUF) that is more robust and has significantly higher throughput than state-of-the-art DRAM PUFs, and (2) the first cold boot attack prevention mechanism that does not introduce any performance or energy overheads at runtime.
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DRAM is the prevalent main memory technology, but its long access latency can limit the performance of many workloads. Although prior works provide DRAM designs that reduce DRAM access latency, their reduced storage capacities hinder the performance of workloads that need large memory capacity. Because the capacity-latency trade-off is fixed at design time, previous works cannot achieve maximum performance under very different and dynamic workload demands. This paper proposes Capacity-Latency-Reconfigurable DRAM (CLR-DRAM), a new DRAM architecture that enables dynamic capacity-latency trade-off at low cost. CLR-DRAM allows dynamic reconfiguration of any DRAM row to switch between two operating modes: 1) max-capacity mode, where every DRAM cell operates individually to achieve approximately the same storage density as a density-optimized commodity DRAM chip and 2) high-performance mode, where two adjacent DRAM cells in a DRAM row and their sense amplifiers are coupled to operate as a single low-latency logical cell driven by a single logical sense amplifier. We implement CLR-DRAM by adding isolation transistors in each DRAM subarray. Our evaluations show that CLR-DRAM can improve system performance and DRAM energy consumption by 18.6% and 29.7% on average with four-core multiprogrammed workloads. We believe that CLR-DRAM opens new research directions for a system to adapt to the diverse and dynamically changing memory capacity and access latency demands of workloads.
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