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Register a new userBeyond the CMOS sensors: the DoTPiX pixel concept and technology for the International Linear Collider A
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Authors
Nicolas T. Fourches CEA/Saclay
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CMOS sensors were successfully implemented in the STAR tracker [1]. LHC experiments have shown that efficient b tagging, reconstruction of displaced vertices and identification of disappearing tracks are necessary. An improved vertex detector is justified for the ILC. To achieve a point(spatial single layer) resolution below the one-{mu}m range while improving other characteristics (radiation tolerance and eventually time resolution) we will need the use of 1-micron pitch pixels. Therefore, we propose a single MOS transistor that acts as an amplifying device and a detector with a buried charge-collecting gate. Device simulations both classical and quantum, have led to the proposed DoTPiX structure. With the evolution of silicon processes, well below 100 nm line feature, this pixel should be feasible. We will present this pixel detector and the present status of its development in both our institution (IRFU) and in other collaborating labs (CNRS/C2N).
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Using the simulation framework of the SiD detector to study the Higgs -> mumu decay channel showed a considerable gain in signal significance could be achieved through an increase in charged particle momentum resolution. However more detailed simulations of theZ -> mumu decay channel demonstrated that significant improvement in the resolution could not be achieved through an increase in tracker granularity. Conversely detector stability studies into missing/dead vertex layers using longer lived particles displayed an increase in track resolution. The existing 9.15 cm x 25 {mu}m silicon strip geometry was replaced with 100 x 100 micrometers silicon pixels improving secondary vertex resolution by a factor of 100. Study into highly collimated events through the use of dense jets showed that momentum resolution can be increased by a factor of 2, greatly improving signal significance but requiring a reduction in pixel size to 25 micrometers. An upgrade of the tracker granularity from the 9.15 cm strips to micrometer sized pixels requires an increase in number and complexity of sensor channels yet provides only a small improvement in the majority of linear collider physics.
CMOS Pixel Sensors tend to become relevant for a growing spectrum of charged particle detection instruments. This comes mainly from their high granularity and low material budget. However, several potential applications require a higher read-out speed and radiation tolerance than those achieved with available devices based on a 0.35 micrometers feature size technology. This paper shows preliminary test results of new prototype sensors manufactured in a 0.18 micrometers process based on a high resistivity epitaxial layer of sizeable thickness. Grounded on these observed performances, we discuss a development strategy over the coming years to reach a full scale sensor matching the specifications of the upgraded version of the Inner Tracking System (ITS) of the ALICE experiment at CERN, for which a sensitive area of up to about 10 square meters may be equipped with pixel sensors.
The EUDET-project was launched to create an infrastructure for developing and testing new and advanced detector technologies to be used at a future linear collider. The aim was to make possible experimentation and analysis of data for institutes, which otherwise could not be realized due to lack of resources. The infrastructure comprised an analysis and software network, and instrumentation infrastructures for tracking detectors as well as for calorimetry.
Monolithic Active Pixel Sensors (MAPS) have been developed since the late 1990s employing silicon substrate with a thin epitaxial layer in which deposited charge is collected by disordered diffusion rather than by drift in an electric field. As a consequence the signal is small and slow, and the radiation tolerance is below the requirements for LHC experiments by factors of 100 to 1000. We developed fully depleted (D)MAPS pixel sensors employing a 150 nm CMOS technology and using a high resistivity substrate as well as a high biasing voltage. The development has been carried out in three subsequent iterations, from prototypes to a large pixel matrix comprising a complete readout architecture suitable for LHC operation. Full CMOS electronics is embedded in large deep n-wells which at the same time serve as collection nodes (large electrode design). The devices have been intensively characterized before and after irradiation employing lab tests as well as particle beams. The devices can cope with particle rates seen by the innermost pixel detectors of the LHC pp-experiments or as seen by the outer pixel layers of the planned HL-LHC upgrade. They are radiation hard to particle fluences of at least $10^{15}~mathrm{n_{eq}/cm^2}$ and total ionization doses of at least 50 Mrad.
CMOS Pixel Sensors are making steady progress towards the specifications of the ILD vertex detector. Recent developments are summarised, which show that these devices are close to comply with all major requirements, in particular the read-out speed needed to cope with the beam related background. This achievement is grounded on the double- sided ladder concept, which allows combining signals generated by a single particle in two different sensors, one devoted to spatial resolution and the other to time stamp, both assembled on the same mechanical support. The status of the development is overviewed as well as the plans to finalise it using an advanced CMOS process.
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