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High-acoustic-index-contrast phononic circuits: numerical modeling

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 Added by Wance Wang
 Publication date 2020
  fields Physics
and research's language is English




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We numerically model key building blocks of a phononic integrated circuit that enable phonon routing in high-acoustic-index waveguides. Our particular focus is on Gallium Nitride-on-sapphire phononic platform which has recently demonstrated high acoustic confinement in its top layer without the use of suspended structures. We start with systematic simulation of various transverse phonon modes supported in strip waveguides and ring resonators with sub-wavelength cross-section. Mode confinement and quality factors of phonon modes are numerically investigated with respect to geometric parameters. Quality factor up to $10^{8}$ is predicted in optimized ring resonators. We next study the design of the phononic directional couplers, and present key design parameters for achieving strong evanescent couplings between modes propagating in parallel waveguides. Last, interdigitated transducer electrodes are included in the simulation for direct excitation of a ring resonator and critical coupling between microwave input and phononic dissipation. Our work provides comprehensive numerical characterization of phonon modes and functional phononic components in high-acoustic-index phononic circuits, which supplements previous theories and contributes to the emerging field of phononic integrated circuits.



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We investigate the prospects for micron-scale acoustic wave components and circuits on chip in solid planar structures that do not require suspension. We leverage evanescent guiding of acoustic waves by high slowness contrast materials readily available in silicon complementary metal-oxide semiconductor (CMOS) processes. High slowness contrast provides strong confinement of GHz frequency acoustic fields in micron-scale structures. We address the fundamental implications of intrinsic material and radiation losses on operating frequency, bandwidth, device size and as a result practicality of multi-element microphononic circuits based on solid embedded waveguides. We show that a family of acoustic components based on evanescently guided acoustic waves, including waveguide bends, evanescent couplers, Y-splitters, and acoustic-wave microring resonators, can be realized in compact, micron-scale structures, and provide basic scaling and performance arguments for these components based on material properties and simulations. We further find that wave propagation losses are expected to permit high quality factor (Q), narrowband resonators and propagation lengths allowing delay lines and the coupling or cascading of multiple components to form functional circuits, of potential utility in guided acoustic signal processing on chip. We also address and simulate bends and radiation loss, providing insight into routing and resonators. Such circuits could be monolithically integrated with electronic and photonic circuits on a single chip with expanded capabilities.
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101 - Daehun Lee , Qiyu Liu , Lu Zheng 2021
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