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Register a new userStack up your chips: Betting on 3D integration to augment Moores Law scaling
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Added by
Saurabh Sinha
Publication date
2020
fields
Informatics Engineering
and research's language is
English
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3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moores law scaling. 3D stacking promises potential gains in performance, power and cost but the actual magnitude of gains varies depending on end-application, technology choices and design. In this talk, we will discuss some key challenges associated with 3D design and how design-for-3D will require us to break traditional silos of micro-architecture, circuit/physical design and manufacturing technology to work across abstractions to enable the gains promised by 3D technologies.
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For a system-level design of Networks-on-Chip for 3D heterogeneous System-on-Chip (SoC), the locations of components, routers and vertical links are determined from an application model and technology parameters. In conventional methods, the two inputs are accounted for separately; here, we define an integrated problem that considers both application model and technology parameters. We show that this problem does not allow for exact solution in reasonable time, as common for many design problems. Therefore, we contribute a heuristic by proposing design steps, which are based on separation of intralayer and interlayer communication. The advantage is that this new problem can be solved with well-known methods. We use 3D Vision SoC case studies to quantify the advantages and the practical usability of the proposed optimization approach. We achieve up to 18.8% reduced white space and up to 12.4% better network performance in comparison to conventional approaches.
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Reliability is a crucial requirement in any modern microprocessor to assure correct execution over its lifetime. As mission critical components are becoming common in commodity systems; e.g., control of autonomous cars, the demand for reliable processing has even further heightened. Latest process technologies even worsened the situation; thus, microprocessors design has become highly susceptible to reliability concerns. This paper examines asymmetric aging phenomenon, which is a major reliability concern in advanced process nodes. In this phenomenon, logical elements and memory cells suffer from unequal timing degradation over time and consequently introduce reliability concerns. So far, most studies approached asymmetric aging from circuit or physical design viewpoint, but these solutions were quite limited and suboptimal. In this paper we introduce an asymmetric aging aware micro-architecture that aims at reducing its impact. The study is mainly focused on the following subsystems: execution units, register files and the memory hierarchy. Our experiments indicate that the proposed solutions incur minimal overhead while significantly mitigating the asymmetric aging stress.
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