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Register a new userOn the Ferroelectric Polarization Switching of Hafnium Zirconium Oxide in Ferroelectric/Dielectric Stack
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The ferroelectric polarization switching in ferroelectric hafnium zirconium oxide (Hf0.5Zr0.5O2, HZO) in the HZO/Al2O3 ferroelectric/dielectric stack is investigated systematically by capacitance-voltage and polarization-voltage measurements. The thickness of dielectric layer is found to have a determinant impact on the ferroelectric polarization switching of ferroelectric HZO. A suppression of ferroelectricity is observed with thick dielectric layer. In the gate stacks with thin dielectric layers, a full polarization switching of the ferroelectric layer is found possible by the proposed leakage-current-assist mechanism through the ultrathin dielectric layer. Theoretical simulation results agree well with experimental data. This work clarifies some of the critical parts of the long-standing confusions and debating related to negative capacitance field-effect transistors (NC-FETs) concepts and experiments.
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In this work, we demonstrate high performance indium-tin-oxide (ITO) transistors with the channel thickness down to 1 nm and ferroelectric Hf0.5Zr0.5O2 as gate dielectric. On-current of 0.243 A/mm is achieved on sub-micron gate-length ITO transistors with a channel thickness of 1 nm, while it increases to as high as 1.06 A/mm when the channel thickness increases to 2 nm. A raised source/drain structure with a thickness of 10 nm is employed, contributing to a low contact resistance of 0.15 {Omega}mm and a low contact resistivity of 1.1{times}10-7 {Omega}cm2. The ITO transistor with a recessed channel and ferroelectric gating demonstrates several advantages over 2D semiconductor transistors and other thin film transistors, including large-area wafer-size nanometer thin film formation, low contact resistance and contact resistivity, atomic thin channel being immunity to short channel effects, large gate modulation of high carrier density by ferroelectric gating, high-quality gate dielectric and passivation formation, and a large bandgap for the low-power back-end-of-line (BEOL) CMOS application.
It was discovered in 2010 that Croconic Acid, in its crystal form, has the highest polarization among organic ferroelectrics. In the context of eliminating toxic substances from electronic devices, Croconic Acid has a great potential as a sublimable lead-free ferroelectric. However, studies on ferroelectric properties of its thin films are only in their early stages and its capability to be incorporated in nanoscale devices is unknown. In this work, we demonstrate, upon ferroelectric switching at the nanoscale, stable and enduring room temperature polarization with no leakage current in Croconic Acid thin films. We thus show that it is a promising lead-free organic ferroelectric toward integration in nanoscale devices. The challenging switching current and polarization reversal characterization at the nanoscale was done using a unique combination of piezoresponse force microscopy, polarization switching current spectroscopy and the concurrent electromechanical strain response. Indeed, this combination can help to rationalize otherwise asymmetric polarization-voltage data and distorted hysteresis due to current jumps below the background noise, which are statistically washed away in macrojunctions but become prevalent at the nanoscale. These results are valid irrespective of the ferroelectrics nature, organic or inorganic. Beyond the potential of Croconic Acid as an ecological ferroelectric material in devices, our detection of a clear nanoscopic polarization switching current thus paves the way for a fundamental understanding and technological applications of the polarization reversal mechanism at the nanoscale.
Ferroelectric field-effect transistors employ a ferroelectric material as a gate insulator, the polarization state of which can be detected using the channel conductance of the device. As a result, the devices are of potential to use in non-volatile memory technology, but suffer from short retention times, which limits their wider application. Here we report a ferroelectric semiconductor field-effect transistor in which a two-dimensional ferroelectric semiconductor, indium selenide ({alpha}-In2Se3), is used as the channel material in the device. {alpha}-In2Se3 was chosen due to its appropriate bandgap, room temperature ferroelectricity, ability to maintain ferroelectricity down to a few atomic layers, and potential for large-area growth. A passivation method based on the atomic-layer deposition of aluminum oxide (Al2O3) was developed to protect and enhance the performance of the transistors. With 15-nm-thick hafnium oxide (HfO2) as a scaled gate dielectric, the resulting devices offer high performance with a large memory window, a high on/off ratio of over 108, a maximum on-current of 862 {mu}A {mu}m-1, and a low supply voltage.
We investigate the polarization switching mechanism in ferroelectric-dielectric (FE-DE) stacks and its dependence on the dielectric thickness (TDE). We fabricate HZO-Al2O3 (FE-DE) stack and experimentally demonstrate a decrease in remnant polarization and an increase in coercive voltage of the FE-DE stack with an increase in TDE. Using phase-field simulations, we show that an increase in TDE results in a larger number of reverse domains in the FE layer to suppress the depolarization field, which leads to a decrease in remanent polarization and an increase in coercive voltage. Further, the applied voltage-driven polarization switching suggests domain-nucleation dominant characteristics for low TDE, and domain-wall motion-induced behavior for higher TDE. In addition, we show that the hysteretic charge-voltage characteristics of the FE layer in the FE-DE stack exhibit a negative slope region due to the multi-domain polarization switching in the FE layer. Based on our analysis, the trends in charge-voltage characteristics of the FE-DE stack with respect to different TDE (which are out of the scope of single-domain models) can be described well with multi-domain polarization switching mechanisms.
The discovery of ferroelectric HfO2 in thin films and more recently in bulk is an important breakthrough because of its silicon-compatibility and unexpectedly persistent polarization at low dimensions, but the origin of its ferroelectricity is still under debate. The stabilization of the metastable polar orthorhombic phase was often considered as the cumulative result of various extrinsic factors such as stress, grain boundary, and oxygen vacancies as well as phase transition kinetics during the annealing process. We propose a novel mechanism to stabilize the polar orthorhombic phase over the nonpolar monoclinic phase that is the bulk ground state. Our first-principles calculations demonstrate that the doubly positively charged oxygen vacancy, an overlooked defect but commonly presented in binary oxides, is critical for the stabilization of ferroelectric phase. The charge state of oxygen vacancy serves as a new degree of freedom to control the thermodynamic stability of competing phases of wide-band-gap oxides.
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