No Arabic abstract
Vertical (-201) and (010) beta-Ga2O3 Schottky barrier diodes (SBDs) were fabricated on single-crystal substrates grown by edge-defined film-fed growth (EFG) method. High resolution X-ray diffraction (HRXRD) and atomic force microscopy (AFM) confirmed good crystal quality and surface morphology of the substrates. The electrical properties of both devices, including current-voltage (I-V) and capacitance-voltage (C-V) characteristics, were comprehensively measured and compared. The (-201) and (010) SBDs exhibited on-resistances (Ron) of 0.56 and 0.77 m{Omega}cm2, turn-on voltages (Von) of 1.0 and 1.3 V, Schottky barrier heights (SBH) of 1.05 and 1.20 eV, electron mobilities of 125 and 65 cm2/(Vs), respectively, with a high on-current of ~1.3 kA/cm2 and on/off ratio of ~109. The (010) SBD had a larger Von and SBH than (-201) SBD due to anisotropic surface properties (i.e., surface Fermi level pinning and band bending), as supported by X-ray photoelectron spectroscopy (XPS) measurements. Temperature-dependent I-V also revealed the inhomogeneous nature of the SBH in both devices, where (-201) SBD showed a more uniform SBH distribution. The homogeneous SBH was also extracted: 1.33 eV for (-201) SBD and 1.53 eV for (010) SBD. The reverse leakage current of the devices was well described by the two-step trap-assisted tunneling model and the one-dimensional variable range hopping conduction (1D-VRH) model. The (-201) SBD showed larger leakage current due to its lower SBH and smaller activation energy. These results indicate the crystalline anisotropy of beta-Ga2O3 can affect the electrical properties of vertical SBDs and should be taken into consideration when designing beta-Ga2O3 electronics.
Vertical $pn$ heterojunction diodes were prepared by plasma-assisted molecular beam epitaxy of unintentionally-doped $p$-type SnO layers with hole concentrations ranging from $p=10^{18}$ to $10^{19}$cm$^{-3}$ on unintentionally-doped $n$-type $beta$-Ga$_{2}$O$_{3}$(-201) substrates with an electron concentration of $n=2.0times10^{17}$cm$^{-3}$. The SnO layers consist of (001)-oriented grains without in-plane expitaxial relation to the substrate. After subsequent contact processing and mesa etching (which drastically reduced the reverse current spreading in the SnO layer and associated high leakage) electrical characterization by current-voltage and capacitance-voltage measurement was performed. The results reveal a type-I band alignment and junction transport by thermionic emission in forward bias. A rectification of $2times10^{8}$ at $pm1$V, an ideality factor of 1.16, differential specific on-resistance of 3.9m$Omegathinspace$cm$^{2}$, and built-in voltage of 0.96V were determined. The $pn$-junction isolation prevented parallel conduction in the highly-conductive Ga$_{2}$O$_{3}$ substrate (sheet resistance $R_{S}approx3thinspaceOmega$) during van-der-Pauw Hall measurements of the SnO layer on top ($R_{S}approx150$k$Omega$, $papprox2.5times10^{18}$cm$^{-3}$, Hall mobility $approx1$cm$^{2}$/Vs). The measured maximum reverse breakdown voltage of the diodes was 66V, corresponding to a peak breakdown field 2.2MV/cm in the Ga$_{2}$O$_{3}$-depletion region. Higher breakdown voltages that are required in high-voltage devices could be achieved by reducing the donor concentration in the $beta$-Ga$_{2}$O$_{3}$ to increase the depletion width as well as improving the contact geometry to reduce field crowding.
We demonstrate the formation of semimetal graphite/semiconductor Schottky barriers where the semiconductor is either silicon (Si), gallium arsenide (GaAs) or 4H-silicon carbide (4H-SiC). Near room temperature, the forward-bias diode characteristics are well described by thermionic emission, and the extracted barrier heights, which are confirmed by capacitance voltage measurements, roughly follow the Schottky-Mott relation. Since the outermost layer of the graphite electrode is a single graphene sheet, we expect that graphene/semiconductor barriers will manifest similar behavior.
The quasi-static anisotropic permittivity parameters of electrically insulating gallium oxide (beta-Ga2O3) were determined by terahertz spectroscopy. Polarization-resolved frequency domain spectroscopy in the spectral range from 200 GHz to 1 THz was carried out on bulk crystals along different orientations. Principal directions for permittivity were determined along crystallographic axes c, and b, and reciprocal lattice direction a*. No significant frequency dispersion in the real part of dielectric permittivity was observed in the measured spectral range. Our results are in excellent agreement with recent radio-frequency capacitance measurements as well as with extrapolations from recent infrared measurements of phonon mode and high frequency contributions, and close the knowledge gap for these parameters in the terahertz spectral range. Our results are important for applications of beta-Ga2O3 in high-frequency electronic devices
We show that it is possible to prepare and identify ultra--thin sheets of graphene on crystalline substrates such as SrTiO$_3$, TiO$_2$, Al$_2$O$_3$ and CaF$_2$ by standard techniques (mechanical exfoliation, optical and atomic force microscopy). On the substrates under consideration we find a similar distribution of single, bi- and few layer graphene and graphite flakes as with conventional SiO$_2$ substrates. The optical contrast $C$ of a single graphene layer on any of those substrates is determined by calculating the optical properties of a two-dimensional metallic sheet on the surface of a dielectric, which yields values between $C=$ ~- 1.5% (G/TiO$_2$) and $C=$ ~- 8.8% (G/CaF$_2$). This contrast is in reasonable agreement with experimental data and is sufficient to make identification by an optical microscope possible. The graphene layers cover the crystalline substrate in a carpet-like mode and the height of single layer graphene on any of the crystalline substrates as determined by atomic force microscopy is $d_{SLG}=0.34$ nm and thus much smaller than on SiO$_2$.
We report the first realization of molecular beam epitaxy grown strained GaN quantum well field-effect transistors on single-crystal bulk AlN substrates. The fabricated double heterostructure FETs exhibit a two- dimensional electron gas (2DEG) density in excess of 2x10^13/cm2. Ohmic contacts to the 2DEG channel were formed by n+ GaN MBE regrowth process, with a contact resistance of 0.13 Ohm-mm. Raman spectroscopy using the quantum well as an optical marker reveals the strain in the quantum well, and strain relaxation in the regrown GaN contacts. A 65-nm-long rectangular-gate device showed a record high DC drain current drive of 2.0 A/mm and peak extrinsic transconductance of 250 mS/mm. Small-signal RF performance of the device achieved current gain cutoff frequency fT~120 GHz. The DC and RF performance demonstrate that bulk AlN substrates offer an attractive alternative platform for strained quantum well nitride transistors for future high-voltage and high-power microwave applications.