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Register a new userDemystifying the Characteristics of 3D-Stacked Memories: A Case Study for Hybrid Memory Cube
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Ramyad Hadidi
Publication date
2017
fields
Informatics Engineering
and research's language is
English
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Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally associated with memories. A practical 3D-stacked memory is Hybrid Memory Cube (HMC), which provides significant access bandwidth and low power consumption in a small area. Although several studies have taken advantage of the novel architecture of HMC, its characteristics in terms of latency and bandwidth or their correlation with temperature and power consumption have not been fully explored. This paper is the first, to the best of our knowledge, to characterize the thermal behavior of HMC in a real environment using the AC-510 accelerator and to identify temperature as a new limitation for this state-of-the-art design space. Moreover, besides bandwidth studies, we deconstruct factors that contribute to latency and reveal their sources for high- and low-load accesses. The results of this paper demonstrates essential behaviors and performance bottlenecks for future explorations of packet-switched and 3D-stacked memories.
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Memories that exploit three-dimensional (3D)-stacking technology, which integrate memory and logic dies in a single stack, are becoming popular. These memories, such as Hybrid Memory Cube (HMC), utilize a network-on-chip (NoC) design for connecting their internal structural organizations. This novel usage of NoC, in addition to aiding processing-in-memory capabilities, enables numerous benefits such as high bandwidth and memory-level parallelism. However, the implications of NoCs on the characteristics of 3D-stacked memories in terms of memory access latency and bandwidth have not been fully explored. This paper addresses this knowledge gap by (i) characterizing an HMC prototype on the AC-510 accelerator board and revealing its access latency behaviors, and (ii) by investigating the implications of such behaviors on system and software designs.
The Von-Neumann bottleneck is a clear limitation for data-intensive applications, bringing in-memory computing (IMC) solutions to the fore. Since large data sets are usually stored in nonvolatile memory (NVM), various solutions have been proposed based on emerging memories, such as OxRAM, that rely mainly on area hungry, one transistor (1T) one OxRAM (1R) bit-cell. To tackle this area issue, while keeping the programming control provided by 1T1R bit-cell, we propose to combine gate-all-around stacked junctionless nanowires (1JL) and OxRAM (1R) technology to create a 3-D memory pillar with ultrahigh density. Nanowire junctionless transistors have been fabricated, characterized, and simulated to define current conditions for the whole pillar. Finally, based on Simulation Program with Integrated Circuit Emphasis (SPICE) simulations, we demonstrated successfully scouting logic operations up to three-pillar layers, with one operand per layer.
Ultra-fast & low-power superconductor single-flux-quantum (SFQ)-based CNN systolic accelerators are built to enhance the CNN inference throughput. However, shift-register (SHIFT)-based scratchpad memory (SPM) arrays prevent a SFQ CNN accelerator from exceeding 40% of its peak throughput, due to the lack of random access capability. This paper first documents our study of a variety of cryogenic memory technologies, including Vortex Transition Memory (VTM), Josephson-CMOS SRAM, MRAM, and Superconducting Nanowire Memory, during which we found that none of the aforementioned technologies made a SFQ CNN accelerator achieve high throughput, small area, and low power simultaneously. Second, we present a heterogeneous SPM architecture, SMART, composed of SHIFT arrays and a random access array to improve the inference throughput of a SFQ CNN systolic accelerator. Third, we propose a fast, low-power and dense pipelined random access CMOS-SFQ array by building SFQ passive-transmission-line-based H-Trees that connect CMOS sub-banks. Finally, we create an ILP-based compiler to deploy CNN models on SMART. Experimental results show that, with the same chip area overhead, compared to the latest SHIFT-based SFQ CNN accelerator, SMART improves the inference throughput by $3.9times$ ($2.2times$), and reduces the inference energy by $86%$ ($71%$) when inferring a single image (a batch of images).
Modern computing systems are embracing non-volatile memory (NVM) to implement high-capacity and low-cost main memory. Elevated operating voltages of NVM accelerate the aging of CMOS transistors in the peripheral circuitry of each memory bank. Aggressive device scaling increases power density and temperature, which further accelerates aging, challenging the reliable operation of NVM-based main memory. We propose HEBE, an architectural technique to mitigate the circuit aging-related problems of NVM-based main memory. HEBE is built on three contributions. First, we propose a new analytical model that can dynamically track the aging in the peripheral circuitry of each memory bank based on the banks utilization. Second, we develop an intelligent memory request scheduler that exploits this aging model at run time to de-stress the peripheral circuitry of a memory bank only when its aging exceeds a critical threshold. Third, we introduce an isolation transistor to decouple parts of a peripheral circuit operating at different voltages, allowing the decoupled logic blocks to undergo long-latency de-stress operations independently and off the critical path of memory read and write accesses, improving performance. We evaluate HEBE with workloads from the SPEC CPU2017 Benchmark suite. Our results show that HEBE significantly improves both performance and lifetime of NVM-based main memory.
The current mobile applications have rapidly growing memory footprints, posing a great challenge for memory system design. Insufficient DRAM main memory will incur frequent data swaps between memory and storage, a process that hurts performance, consumes energy and deteriorates the write endurance of typical flash storage devices. Alternately, a larger DRAM has higher leakage power and drains the battery faster. Further, DRAM scaling trends make further growth of DRAMin the mobile space prohibitive due to cost. Emerging non-volatile memory (NVM) has the potential to alleviate these issues due to its higher capacity per cost than DRAM and mini-mal static power. Recently, a wide spectrum of NVM technologies, including phase-change memories (PCM), memristor, and 3D XPoint have emerged. Despite the mentioned advantages, NVM has longer access latency compared to DRAMand NVM writes can incur higher latencies and wear costs. Therefore integration of these new memory technologies in the memory hierarchy requires a fundamental rearchitect-ing of traditional system designs. In this work, we propose a hardware-accelerated memory manager (HMMU) that addresses both types of memory in a flat space address space. We design a set of data placement and data migration policies within this memory manager, such that we may exploit the advantages of each memory technology. By augmenting the system with this HMMU, we reduce the overall memory latency while also reducing writes to the NVM. Experimental results show that our design achieves a 39% reduction in energy consumption with only a 12% performance degradation versus an all-DRAM baseline that is likely untenable in the future.
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