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Register a new userThermal conductance of Nb thin films at sub-kelvin temperatures
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We determine the thermal conductance of thin niobium (Nb) wires on a silica substrate in the temperature range of 0.1 - 0.6 K using electron thermometry based on normal metal-insulator-superconductor tunnel junctions. We find that at 0.6 K, the thermal conductance of Nb is two orders of magnitude lower than that of Al in the superconducting state, and two orders of magnitude below the Wiedemann-Franz conductance calculated with the normal state resistance of the wire. The measured thermal conductance exceeds the prediction of the Bardeen-Cooper-Schrieffer theory, and demonstrates a power law dependence on temperature as $T^{4.5}$, instead of an exponential one. At the same time, we monitor the temperature profile of the substrate along the Nb wire to observe possible overheating of the phonon bath. We show that Nb can be successfully used for thermal insulation in a nanoscale circuit while simultaneously providing an electrical connection.
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The performance of low temperature detectors utilizing thermal effects is determined by their energy relaxation properties. Usually, heat transport experiments in mesoscopic structures are carried out in the steady-state, where temperature gradients do not change in time. Here, we present an experimental study of dynamic thermal relaxation in a mesoscopic system -- thin metallic film. We find that the thermal relaxation of hot electrons in copper and silver films is characterized by several time constants, and that the annealing of the films changes them. In most cases, two time constants are observed, and we can model the system by introducing an additional thermal reservoir coupled to the film electrons. We determine the specific heat of this reservoir and its coupling to the electrons. The experiments point at the importance of grain structure on the thermal relaxation of electrons in metallic films.
We have measured the electronic heat capacity of thin film nanowires of copper and silver at temperatures 0.1 - 0.3 K; the films were deposited by standard electron-beam evaporation. The specific heat of the Ag films of sub-100 nm thickness agrees with the bulk value and the free-electron estimate, whereas that of similar Cu films exceeds the corresponding reference values by one order of magnitude. The origin of the anomalously high heat capacity of copper films remains unknown for the moment. Based on the low heat capacity and the possibility to devise a tunnel probe thermometer on it, the Ag films form a promising absorber material, e.g., for micro-wave photon calorimetry.
We report the first experimental observation of superconductivity in Cd$_3$As$_2$ thin films without application of external pressure. Surface studies suggest that the observed transport characteristics are related to the polycrystalline continuous part of investigated films with homogeneous distribution of elements and the Cd-to-As ratio close to stoichiometric Cd$_3$As$_2$. The latter is also supported by Raman spectra of the studied films, which are similar to those of Cd$_3$As$_2$ single crystals. The formation of superconducting phase in films under study is confirmed by the characteristic behavior of temperature and magnetic field dependence of samples resistances, as well as by the presence of pronounced zero-resistance plateaux in $dV/dI$ characteristics. The corresponding $H_c-T_c$ plots reveal a clearly pronounced linear behavior within the intermediate temperature range, similar to that observed for bulk Cd$_3$As$_2$ and Bi$_2$Se$_3$ films under pressure, suggesting the possibility of nontrivial pairing in the films under investigation. We discuss a possible role of sample inhomogeneities and crystal strains in the observed phenomena.
Continuing advancements in quantum information processing have caused a paradigm shift from research mainly focused on testing the reality of quantum mechanics to engineering qubit devices with numbers required for practical quantum computation. One of the major challenges in scaling toward large-scale solid-state systems is the limited input/output (I/O) connectors present in cryostats operating at sub-kelvin temperatures required to execute quantum logic with high-fidelity. This interconnect bottleneck is equally present in the device fabrication-measurement cycle, which requires high-throughput and cryogenic characterization to develop quantum processors. Here we multiplex quantum transport of two-dimensional electron gases at sub-kelvin temperatures. We use commercial off-the-shelf CMOS multiplexers to achieve an order of magnitude increase in the number of wires. Exploiting this technology we advance 300 mm epitaxial wafers manufactured in an industrial CMOS fab to a record electron mobility of (3.9$pm$0.6)$times$10$^5$ cm$^2$slash Vs and percolation density of (6.9$pm$0.4)$times$10$^{10}$ cm$^{-2}$, representing a key step toward large silicon qubit arrays. We envision that the demonstration will inspire the development of cryogenic electronics for quantum information and because of the simplicity of assembly, low-cost, yet versatility, we foresee widespread use of similar cryo-CMOS circuits for high-throughput quantum measurements and control of quantum engineered systems.
In this work, we report on hot carrier diffusion in graphene across large enough length scales that the carriers are not thermalized across the crystal. The carriers are injected into graphene at one site and their thermal transport is studied as a function of applied power and distance from the heating source, up to tens of micrometers away. Superconducting contacts prevent out-diffusion of hot carriers to isolate the electron-phonon coupling as the sole channel for thermal relaxation. As local thermometers, we use the amplitude of the Universal Conductance Fluctuations, which varies monotonically as a function of temperature. By measuring the electron temperature simultaneously along the length we observe a thermal gradient which results from the competition between electron-phonon cooling and lateral heat flow.
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