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Register a new userCLEAR: Cross-Layer Exploration for Architecting Resilience - Combining Hardware and Software Techniques to Tolerate Soft Errors in Processor Cores
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Eric Cheng
Publication date
2016
fields
Informatics Engineering
and research's language is
English
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We present a first of its kind framework which overcomes a major challenge in the design of digital systems that are resilient to reliability failures: achieve desired resilience targets at minimal costs (energy, power, execution time, area) by combining resilience techniques across various layers of the system stack (circuit, logic, architecture, software, algorithm). This is also referred to as cross-layer resilience. In this paper, we focus on radiation-induced soft errors in processor cores. We address both single-event upsets (SEUs) and single-event multiple upsets (SEMUs) in terrestrial environments. Our framework automatically and systematically explores the large space of comprehensive resilience techniques and their combinations across various layers of the system stack (586 cross-layer combinations in this paper), derives cost-effective solutions that achieve resilience targets at minimal costs, and provides guidelines for the design of new resilience techniques. We demonstrate the practicality and effectiveness of our framework using two diverse designs: a simple, in-order processor core and a complex, out-of-order processor core. Our results demonstrate that a carefully optimized combination of circuit-level hardening, logic-level parity checking, and micro-architectural recovery provides a highly cost-effective soft error resilience solution for general-purpose processor cores. For example, a 50x improvement in silent data corruption rate is achieved at only 2.1% energy cost for an out-of-order core (6.1% for an in-order core) with no speed impact. However, selective circuit-level hardening alone, guided by a thorough analysis of the effects of soft errors on application benchmarks, provides a cost-effective soft error resilience solution as well (with ~1% additional energy cost for a 50x improvement in silent data corruption rate).
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We present CLEAR (Cross-Layer Exploration for Architecting Resilience), a first of its kind framework which overcomes a major challenge in the design of digital systems that are resilient to reliability failures: achieve desired resilience targets at minimal costs (energy, power, execution time, area) by combining resilience techniques across various layers of the system stack (circuit, logic, architecture, software, algorithm). This is also referred to as cross-layer resilience. In this paper, we focus on radiation-induced soft errors in processor cores. We address both single-event upsets (SEUs) and single-event multiple upsets (SEMUs) in terrestrial environments. Our framework automatically and systematically explores the large space of comprehensive resilience techniques and their combinations across various layers of the system stack (586 cross-layer combinations in this paper), derives cost-effective solutions that achieve resilience targets at minimal costs, and provides guidelines for the design of new resilience techniques. Our results demonstrate that a carefully optimized combination of circuit-level hardening, logic-level parity checking, and micro-architectural recovery provides a highly cost-effective soft error resilience solution for general-purpose processor cores. For example, a 50x improvement in silent data corruption rate is achieved at only 2.1% energy cost for an out-of-order core (6.1% for an in-order core) with no speed impact. However, (application-aware) selective circuit-level hardening alone, guided by a thorough analysis of the effects of soft errors on application benchmarks, provides a cost-effective soft error resilience solution as well (with ~1% additional energy cost for a 50x improvement in silent data corruption rate).
Field programmable gate arrays (FPGAs) provide designers with the ability to quickly create hardware circuits. Increases in FPGA configurable logic capacity and decreasing FPGA costs have enabled designers to more readily incorporate FPGAs in their designs. FPGA vendors have begun providing configurable soft processor cores that can be synthesized onto their FPGA products. While FPGAs with soft processor cores provide designers with increased flexibility, such processors typically have degraded performance and energy consumption compared to hard-core processors. Previously, we proposed warp processing, a technique capable of optimizing a software application by dynamically and transparently re-implementing critical software kernels as custom circuits in on-chip configurable logic. In this paper, we study the potential of a MicroBlaze soft-core based warp processing system to eliminate the performance and energy overhead of a soft-core processor compared to a hard-core processor. We demonstrate that the soft-core based warp processor achieves average speedups of 5.8 and energy reductions of 57% compared to the soft core alone. Our data shows that a soft-core based warp processor yields performance and energy consumption competitive with existing hard-core processors, thus expanding the usefulness of soft processor cores on FPGAs to a broader range of applications.
Hardware flaws are permanent and potent: hardware cannot be patched once fabricated, and any flaws may undermine any software executing on top. Consequently, verification time dominates implementation time. The gold standard in hardware Design Verification (DV) is concentrated at two extremes: random dynamic verification and formal verification. Both struggle to root out the subtle flaws in complex hardware that often manifest as security vulnerabilities. The root problem with random verification is its undirected nature, making it inefficient, while formal verification is constrained by the state-space explosion problem, making it infeasible against complex designs. What is needed is a solution that is directed, yet under-constrained. Instead of making incremental improvements to existing DV approaches, we leverage the observation that existing software fuzzers already provide such a solution, and adapt them for hardware DV. Specifically, we translate RTL hardware to a software model and fuzz that model. The central challenge we address is how best to mitigate the differences between the hardware execution model and software execution model. This includes: 1) how to represent test cases, 2) what is the hardware equivalent of a crash, 3) what is an appropriate coverage metric, and 4) how to create a general-purpose fuzzing harness for hardware. To evaluate our approach, we fuzz four IP blocks from Googles OpenTitan SoC. Our experiments reveal a two orders-of-magnitude reduction in run time to achieve Finite State Machine (FSM) coverage over traditional dynamic verification schemes. Moreover, with our design-agnostic harness, we achieve over 88% HDL line coverage in three out of four of our designs -- even without any initial seeds.
Tensor computations overwhelm traditional general-purpose computing devices due to the large amounts of data and operations of the computations. They call for a holistic solution composed of both hardware acceleration and software mapping. Hardware/software (HW/SW) co-design optimizes the hardware and software in concert and produces high-quality solutions. There are two main challenges in the co-design flow. First, multiple methods exist to partition tensor computation and have different impacts on performance and energy efficiency. Besides, the hardware part must be implemented by the intrinsic functions of spatial accelerators. It is hard for programmers to identify and analyze the partitioning methods manually. Second, the overall design space composed of HW/SW partitioning, hardware optimization, and software optimization is huge. The design space needs to be efficiently explored. To this end, we propose an agile co-design approach HASCO that provides an efficient HW/SW solution to dense tensor computation. We use tensor syntax trees as the unified IR, based on which we develop a two-step approach to identify partitioning methods. For each method, HASCO explores the hardware and software design spaces. We propose different algorithms for the explorations, as they have distinct objectives and evaluation costs. Concretely, we develop a multi-objective Bayesian optimization algorithm to explore hardware optimization. For software optimization, we use heuristic and Q-learning algorithms. Experiments demonstrate that HASCO achieves a 1.25X to 1.44X latency reduction through HW/SW co-design compared with developing the hardware and software separately.
With the scaling of technology and higher requirements on performance and functionality, power dissipation is becoming one of the major design considerations in the development of network processors. In this paper, we use an assertion-based methodology for system-level power/performance analysis to study two dynamic voltage scaling (DVS) techniques, traffic-based DVS and execution-based DVS, in a network processor model. Using the automatically generated distribution analyzers, we analyze the power and performance distributions and study their trade-offs for the two DVS policies with different parameter settings such as threshold values and window sizes. We discuss the optimal configurations of the two DVS policies under different design requirements. By a set of experiments, we show that the assertion-based trace analysis methodology is an efficient tool that can help a designer easily compare and study optimal architectural configurations in a large design space.
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