The highly advanced treatment of surfaces as etching and deposition is mainly enabled by the extraordinary properties of technological plasmas. The primary factors that influence these processes are the flux and the energy of various species, particularly ions, that impinge the substrate surface. These features can be theoretically described using the ion energy distribution function (IEDF). The article is intended to summarize the fundamental concepts of modeling and simulation of IEDFs from simplified models to self-consistent plasma simulations. Finally, concepts for controlling the IEDF are discussed.
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