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We present a DevIce-to-System Performance EvaLuation (DISPEL) workflow that integrates transistor and interconnect modeling, parasitic extraction, standard cell library characterization, logic synthesis, cell placement and routing, and timing analysis to evaluate system-level performance of new CMOS technologies. As the impact of parasitic resistances and capacitances continues to increase with dimensional downscaling, component-level optimization alone becomes insufficient, calling for a holistic assessment and optimization methodology across the boundaries between devices, interconnects, circuits, and systems. The physical implementation flow in DISPEL enables realistic analysis of complex wires and vias in VLSI systems and their impact on the chip power, speed, and area, which simple circuit simulations cannot capture. To demonstrate the use of DISPEL, a 32-bit commercial processor core is implemented using theoretical n-type MoS2 and p-type Black Phosphorous (BP) planar FETs at a projected 5-nm node, and the performance is benchmarked against Si FinFETs. While the superior gate control of the MoS2/BP FETs can theoretically provide 51% reduction in the iso-frequency energy consumption, the actual performance can be greatly limited by the source/drain contact resistances. With the large amount of data generated by DISPEL, a neural-network is trained to predict the key performance metrics of the 32-bit processor core using the characteristics of transistors and interconnects as the input features without the need to go through the time-consuming physical implementation flow. The machine learning algorithms show great potentials as a means for evaluation and optimization of new CMOS technologies and identifying the most significant technology design parameters.
Numerous neural network circuits and architectures are presently under active research for application to artificial intelligence and machine learning. Their physical performance metrics (area, time, energy) are estimated. Various types of neural net
Optical Network-on-Chip (ONoC) is an emerging technology considered as one of the key solutions for future generation on-chip interconnects. However, silicon photonic devices in ONoC are highly sensitive to temperature variation, which leads to a low
We propose a technology-independent method, referred to as adjacent connection matrix (ACM), to efficiently map signed weight matrices to non-negative crossbar arrays. When compared to same-hardware-overhead mapping methods, using ACM leads to improv
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