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Register a new userStudy of the Tracking Method and Expected Performance of the Silicon Pixel Inner Tracker Applied in BESIII
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The inner drift chamber of the BESIII is encountering serious aging problem after five years running. For the first layer, the decrease in gas gain is about 26% from 2009 to 2013. The upgrade of the inner tracking detector has become an urgent problem for the BESIII experiment. An inner tracker using CMOS pixel sensors is an important candidate because of its great advantages on spatial resolution and radiation hardness. In order to carry out a Monte Carlo study on the expected performance, a Geant4-based full simulation for the silicon pixel detector has been implemented. The tracking method combining the silicon pixel inner tracker and outer drift chamber has been studied and a preliminary reconstruction software was developed. The Monte Carlo study shows that the performances including momentum resolution, vertex resolution and the tracking efficiency are significantly improved due to the good spatial resolution and moderate material budget of the silicon pixel detector.
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The Cylindrical GEM-Inner Tracker (CGEM-IT) is the upgrade of the internal tracking system of the BESIII experiment. It consists of three layers of cylindrically-shaped triple GEMs, with important innovations with respect to the existing GEM detectors, in order to achieve the best performance with the lowest material budget. It will be the first cylindrical GEM running with analog readout inside a 1T magnetic field. The simultaneous measurement of both the deposited charge and the signal time will permit to use a combination of two algorithms to evaluate the spatial position of the charged tracks inside the CGEM-IT: the charge centroid and the micro time projection chamber modes. They are complementary and can cope with the asymmetry of the electron avalanche when running in magnetic field and with non-orthogonal incident tracks. To evaluate the behavior under different working settings, both planar chambers and the first cylindrical prototype have been tested during various test beams at CERN with 150 GeV/c muons and pions. This paper reports the results obtained with the two reconstruction methods and a comparison between the planar and cylindrical chambers.
The Beijing Electron Spectrometer III (BESIII) is a multipurpose detector that collects data provided by the collision in the Beijing Electron Positron Collider II (BEPCII), hosted at the Institute of High Energy Physics of Beijing. Since the beginning of its operation, BESIII has collected the world largest sample of J/{psi} and {psi}(2s). Due to the increase of the luminosity up to its nominal value of 10^33 cm-2 s-1 and aging effect, the MDC decreases its efficiency in the first layers up to 35% with respect to the value in 2014. Since BESIII has to take data up to 2022 with the chance to continue up to 2027, the Italian collaboration proposed to replace the inner part of the MDC with three independent layers of Cylindrical triple-GEM (CGEM). The CGEM-IT project will deploy several new features and innovation with respect the other current GEM based detector: the {mu}TPC and analog readout, with time and charge measurements will allow to reach the 130 {mu}m spatial resolution in 1 T magnetic field requested by the BESIII collaboration. In this proceeding, an update of the status of the project will be presented, with a particular focus on the results with planar and cylindrical prototypes with test beams data. These results are beyond the state of the art for GEM technology in magnetic field.
Using the simulation framework of the SiD detector to study the Higgs -> mumu decay channel showed a considerable gain in signal significance could be achieved through an increase in charged particle momentum resolution. However more detailed simulations of theZ -> mumu decay channel demonstrated that significant improvement in the resolution could not be achieved through an increase in tracker granularity. Conversely detector stability studies into missing/dead vertex layers using longer lived particles displayed an increase in track resolution. The existing 9.15 cm x 25 {mu}m silicon strip geometry was replaced with 100 x 100 micrometers silicon pixels improving secondary vertex resolution by a factor of 100. Study into highly collimated events through the use of dense jets showed that momentum resolution can be increased by a factor of 2, greatly improving signal significance but requiring a reduction in pixel size to 25 micrometers. An upgrade of the tracker granularity from the 9.15 cm strips to micrometer sized pixels requires an increase in number and complexity of sensor channels yet provides only a small improvement in the majority of linear collider physics.
CMOS Pixel Sensors tend to become relevant for a growing spectrum of charged particle detection instruments. This comes mainly from their high granularity and low material budget. However, several potential applications require a higher read-out speed and radiation tolerance than those achieved with available devices based on a 0.35 micrometers feature size technology. This paper shows preliminary test results of new prototype sensors manufactured in a 0.18 micrometers process based on a high resistivity epitaxial layer of sizeable thickness. Grounded on these observed performances, we discuss a development strategy over the coming years to reach a full scale sensor matching the specifications of the upgraded version of the Inner Tracking System (ITS) of the ALICE experiment at CERN, for which a sensitive area of up to about 10 square meters may be equipped with pixel sensors.
In order to achieve the challenging requirements on the CLIC vertex detector, a range of technology options have been considered in recent years. One prominent idea is the use of active sensors implemented in a commercial high-voltage CMOS process, capacitively coupled to hybrid pixel readout chips. Recent results have shown the approach to be feasible, though more detailed studies of the performance of such devices, including simulation, are required. The CLICdp collaboration has developed a number of ASICs as part of its vertex detector R&D programme, and here we present results on the performance of a CCPDv3 active sensor glued to a CLICpix readout chip. Charge collection characteristics and tracking performance have been measured over the full expected angular range of incident particles using 120 GeV/c secondary hadron beams from the CERN SPS. Single hit efficiencies have been observed above 99% in the full range of track incidence angles, down to shallow angles. The single hit resolution has also been observed to be stable over this range, with a resolution around 6 $mu$m. The measured charge collection characterstics have been compared to simulations carried out using the Sentaurus TCAD finite-element simulation package combined with circuit simulations and parametrisations of the readout chip response. The simulations have also been successfully used to reproduce electric fields, depletion depths and the current-voltage characteristics of the device, and have been further used to make predictions about future device designs.
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