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Register a new userOn efficient asymptotic modelling of thin films on thermally conductive substrates
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We consider a free surface thin film placed on a thermally conductive substrate and exposed to an external heat source in a setup where the heat absorption depends on the local film thickness. Our focus is on modeling film evolution while the film is molten. The evolution of the film modifies local heat flow, which in turn may influence the film surface evolution through thermal variation of the films material properties. Thermal conductivity of the substrate plays an important role in determining the heat flow and the temperature field in the evolving film and in the substrate itself. In order to reach a tractable formulation, we use asymptotic analysis to develop a novel thermal model that is accurate, computationally efficient, and that accounts for the heat flow in both the in-plane and out-of plane directions. We apply this model to metal films of nanoscale thickness exposed to heating and melting by laser pulses, a setup commonly used for self and directed assembly of various metal geometries via dewetting while the films are in the liquid phase. We find that thermal effects play an important role, and in particular that the inclusion of temperature dependence in the metal viscosity modifies the time scale of the evolution significantly. On the other hand, in the considered setup the Marangoni (thermocapillary) effect turns out to be insignificant.
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A thin liquid film with non-zero curvature at its free surface spontaneously flows to reach a flat configuration, a process driven by Laplace pressure gradients and resisted by the liquids viscosity. Inspired by recent progresses on the dynamics of liquid droplets on soft substrates, we here study the relaxation of a viscous film supported by an elastic foundation. Experiments involve thin polymer films on elastomeric substrates, where the dynamics of the liquid-air interface is monitored using atomic force microscopy. A theoretical model that describes the coupled evolution of the solid-liquid and the liquid-air interfaces is also provided. In this soft-levelling configuration, Laplace pressure gradients not only drive the flow, but they also induce elastic deformations on the substrate that affect the flow and the shape of the liquid-air interface itself. This process represents an original example of elastocapillarity that is not mediated by the presence of a contact line. We discuss the impact of the elastic contribution on the levelling dynamics and show the departure from the classical self-similarities and power laws observed for capillary levelling on rigid substrates.
We apply a previously developed asymptotic model (J. Fluid. Mech. 915, A133 (2021)) to study instabilities of free surface films of nanometric thickness on thermally conductive substrates in two and three spatial dimensions. While the specific focus is on metal films exposed to laser heating, the model itself applies to any setup involving films on the nanoscale whose material parameters are temperature-dependent. For the particular case of metal films heated from above, an important aspect is that the considered heating is volumetric, since the absorption length of the applied laser pulse is comparable to the film thickness. In such a setup, absorption of thermal energy and film evolution are closely correlated and must be considered self-consistently. The asymptotic model allows for a significant simplification, which is crucial from both modeling and computational points of view, since it allows for asymptotically correct averaging of the temperature over the film thickness. We find that the properties of the thermally conductive substrate -- in particular its thickness and rate of heat loss -- play a critical role in controlling the film temperature and dynamics. The film evolution is simulated using efficient GPU-based simulations which, when combined with the developed asymptotic model, allow for fully nonlinear time-dependent simulations in large three-dimensional computational domains. In addition to uncovering the role of the substrate and its properties in determining the film evolution, one important finding is that, at least for the considered range of material parameters, strong in-plane thermal diffusion in the film results in negligible spatial variations of temperature, and the film evolution is predominantly influenced by temporal variation of film viscosity and surface tension (dictated by average film temperature), as well as thermal conductivity of the substrate.
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