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Register a new userInfrared Thermography of Complex 3D Printed Components
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The possibility of using Infrared Lock-In Thermography (LIT) to estimate the thickness of a sample was assessed and shown to be accurate up to 1.8mm. LIT is a technique involving heating samples with halogen lamps with varying intensity over time. The intensity is defined by sinusoidal functions. LIT was conducted on samples of varying thickness, gradient, and shape. The Lock-In phase signals were calculated, and a database was then created with the data obtained and was used to estimate the thickness based on the original phase signal. A relationship between gradient and phase signal was also shown based on our data, contrary to current findings in existing literature.
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Lock-In thermography is a useful Non Destructive Technique (NDT) for enhanced detection of defects in components, as it amplifies the phase contrast where defects exist. This amplification was found to be around 2-3 times compared to constant heating. The current used a Fuse Deposition Modelling (FDM) 3D printer to print samples with known defects, in order to characterise the relative effects of different variables on the Lock-In phase data. Samples were printed using ABS (Acrylonitrile Butadiene Styrene) and PLA (Polylactic Acid) for comparisons, and variables such as print direction, cameras, heating power, Lock-In frequency, as well as thickness, width and depth of defects were explored. It was found that different materials resulted in different baselines, but had similar phase contrast. A novel asynchronous technique was derived to enable Lock-In measurements with 5 different infrared cameras, and similar results were found. Even cheap cameras like the Seek Thermal CompactXR were proven capable of detecting the same defects as other cameras such as the FLIR SC7500. Heating power did not affect phase contrast, except for shallower defects up to 1.0 mm deep, where higher power resulted in better contrast. As expected, deeper defects could only be detected using lower Lock-In frequencies, and there was better phase contrast with wider, thicker and shallower defects. It was shown that defects 4 mm in width could be detected automatically up to a depth of around 1.5 mm, based on the phase signal trends. Sub-sampling of frame data showed that at least 10 frames were required per Lock-In period for minimal deviations in Lock-In phase contrast. Also, it was shown that phase contrast was similar for shallower defects up to 1.5 mm deep, with data from 1 Lock-In period, as long as the first frame was synchronised with the heating cycle.
In this work, We combined fully atomistic molecular dynamics and finite elements simulations with mechanical testings to investigate the mechanical behavior of atomic and 3D-printed models of pentadiamond. Pentadiamond is a recently proposed new carbon allotrope, which is composed of a covalent network of pentagonal rings. Our results showed that the stress-strain behavior is almost scale-independent. The stress-strain curves of the 3D-printed structures exhibit three characteristic regions. For low-strain values, this first region presents a non-linear behavior close to zero, followed by a well-defined linear behavior. The second regime is a quasi-plastic one and the third one is densification followed by structural failures (fracture). The Youngs modulus values decrease with the number of pores. The deformation mechanism is bending-dominated and different from the layer-by-layer deformation mechanism observed for other 3D-printed structures. They exhibit good energy absorption capabilities, with some structures even outperforming kevlar. Interestingly, considering the Ashby chart, 3D-printed pentadiamond lies almost on the ideal stretch and bending-dominated lines, making them promising materials for energy absorption applications.
Compact and robust waveguide chips are crucial for new integrated terahertz applications, such as high-speed interconnections between processors and broadband short-range wireless communications. Progress on topological photonic crystals shows potential to improve integrated terahertz systems that suffer from high losses around sharp bends. Robust terahertz topological transport through sharp bends on a silicon chip has been recently reported over a relatively narrow bandwidth. Here, we report the experimental demonstration of topological terahertz planar air-channel metallic waveguides which can be integrated into an on-chip interconnect. Our platform can be fabricated by a simple, cost-effective technique combining 3D-printing and gold-sputtering. The relative size of the measured topological bandgap is ~12.5%, which entails significant improvement over all-silicon terahertz topological waveguides (~7.8%). We further demonstrate robust THz propagation around defects and delay lines. Our work provides a promising path towards compact integrated terahertz devices as a next frontier for terahertz wireless communications.
Nowadays is very common to find headlines in the media where it is stated that 3D printing is a technology called to change our lives in the near future. For many authors, we are living in times of a third industrial revolution. Howerver, we are currently in a stage of development where the use of 3D printing is advantageous over other manufacturing technologies only in rare scenarios. Fortunately, scientific research is one of them. Here we present the development of a set of opto-mechanical components that can be built easily using a 3D printer based on Fused Filament Fabrication (FFF) and parts that can be found on any hardware store. The components of the set presented here are highly customizable, low-cost, require a short time to be fabricated and offer a performance that compares favorably with respect to low-end commercial alternatives.
Mass production of photonic integrated circuits requires high-throughput wafer-level testing. We demonstrate that optical probes equipped with 3D-printed elements allow for efficient coupling of light to etched facets of nanophotonic waveguides. The technique is widely applicable to different integration platforms.
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