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Register a new userGraphene Helicoid: The Distinct Properties Promote Application of Graphene Related Materials in Thermal Management
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The extremely high thermal conductivity of graphene has received great attention both in experiments and calculations. Obviously, new feature in thermal properties is of primary importance for application of graphene-based materials in thermal management in nanoscale. Here, we studied the thermal conductivity of graphene helicoid, a newly reported graphene-related nanostructure, using molecular dynamics simulation. Interestingly, in contrast to the converged cross-plane thermal conductivity in multi-layer graphene, axial thermal conductivity of graphene helicoid keeps increasing with thickness with a power law scaling relationship, which is a consequence of the divergent in-plane thermal conductivity of two-dimensional graphene. Moreover, the large overlap between adjacent layers in graphene helicoid also promotes higher thermal conductivity than multi-layer graphene. Furthermore, in the small strain regime (< 10%), compressive strain can effectively increase the thermal conductivity of graphene helicoid, while in the ultra large strain regime (~100% to 500%), tensile strain does not decrease the heat current, unlike that in generic solid-state materials. Our results reveal that the divergence in thermal conductivity, associated with the anomalous strain dependence and the unique structural flexibility, make graphene helicoid a new platform for studying fascinating phenomena of key relevance to the scientific understanding and technological applications of graphene-related materials.
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The increase in the temperature of photovoltaic (PV) solar cells affects negatively their power conversion efficiency and decreases their lifetime. The negative effects are particularly pronounced in concentrator solar cells. Therefore, it is crucial to limit the PV cell temperature by effectively removing the excess heat. Conventional thermal phase change materials (PCMs) and thermal interface materials (TIMs) do not possess the thermal conductivity values sufficient for thermal management of the next generation of PV cells. In this paper, we report the results of investigation of the increased efficiency of PV cells with the use of graphene-enhanced TIMs. Graphene reveals the highest values of the intrinsic thermal conductivity. It was also shown that the thermal conductivity of composites can be increased via utilization of graphene fillers. We prepared TIMs with up to 6% of graphene designed specifically for PV cell application. The solar cells were tested using the solar simulation module. It was found that the drop in the output voltage of the solar panel under two-sun concentrated illumination can be reduced from 19% to 6% when graphene-enhanced TIMs are used. The proposed method can recover up to 75% of the power loss in solar cells.
Graphene was recently proposed as a material for heat removal owing to its extremely high thermal conductivity. We simulated heat propagation in silicon-on-insulator circuits with and without graphene lateral heat spreaders. Numerical solutions of the heat propagation equations were obtained using the finite element method. The analysis was focused on the prototype silicon-on-insulator circuits with the metal-oxide-semiconductor field-effect transistors. It was found that the incorporation of graphene or few-layer graphene layers with proper heat sinks can substantially lower the temperature of the localized hot spots. The maximum temperature in the transistor channels was studied as function of graphenes thermal conductivity and the thickness of the few-layer-graphene. The developed model and obtained results are important for the design of graphene heat spreaders and interconnects.
We report on heat conduction properties of thermal interface materials with self-aligning magnetic grapheme fillers. Graphene enhanced nano-composites were synthesized by an inexpensive and scalable technique based on liquid-phase exfoliation. Functionalization of graphene and few-layer-graphene flakes with Fe3O4 nanoparticles allowed us to align the fillers in an external magnetic field during dispersion of the thermal paste to the connecting surfaces. The filler alignment results in a strong increase of the apparent thermal conductivity and thermal diffusivity through the layer of nano-composite inserted between two metallic surfaces. The self-aligning magnetic grapheme fillers improve heat conduction in composites with both curing and non-curing matrix materials. The thermal conductivity enhancement with the oriented fillers is a factor of two larger than that with the random fillers even at the low ~1 wt. % of graphene loading. The real-life testing with computer chips demonstrated the temperature rise decrease by as much as 10oC with use of the non-curing thermal interface material with ~1 wt. % of the oriented fillers. Our proof-of-concept experiments suggest that the thermal interface materials with functionalized graphene and few-layer-graphene fillers, which can be oriented during the composite application to the surfaces, can lead to a new method of thermal management of advanced electronics.
We investigated theoretically the phonon thermal conductivity of single layer graphene. The phonon dispersion for all polarizations and crystallographic directions in graphene lattice was obtained using the valence-force field method. The three-phonon Umklapp processes were treated exactly using an accurate phonon dispersion and Brillouin zone, and accouting for all phonon relaxation channels allowed by the momentum and energy conservation laws. The uniqueness of graphene was reflected in the two-dimensional phonon density of states and restrictions on the phonon Umklapp scattering phase-space. The phonon scattering on defects and graphene edges has been also included in the model. The calculations were performed for the Gruneisen parameter, which was determined from the ab initio theory as a function of the phonon wave vector and polarization branch, and for a range of values from experiments. It was found that the near room-temperature thermal conductivity of single layer graphene, calculated with a realistic Gruneisen parameter, is in the range ~ 2000 - 5000 W/mK depending on the defect concentration and roughness of the edges. Owing to the long phonon mean free path the graphene edges produce strong effect on thermal conductivity even at room temperature. The obtained results are in good agreement with the recent measurements of the thermal conductivity of suspended graphene.
We investigated thermal properties of the epoxy-based composites with a high loading fraction - up to f=45 vol.% - of the randomly oriented electrically conductive graphene fillers and electrically insulating boron nitride fillers. It was found that both types of the composites revealed a distinctive thermal percolation threshold at the loading fraction f>20 vol.%. The graphene loading required for achieving the thermal percolation was substantially higher than the loading for the electrical percolation. Graphene fillers outperformed boron nitride fillers in the thermal conductivity enhancement. It was established that thermal transport in composites with the high filler loading, above the thermal percolation threshold, is dominated by heat conduction via the network of percolating fillers. Unexpectedly, we determined that the thermal transport properties of the high loading composites were influenced strongly by the cross-plane thermal conductivity of the quasi-two-dimensional fillers. The obtained results shed light on the debated mechanism of the thermal percolation, and facilitate the development of the next generation of the efficient thermal interface materials for electronic applications.
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