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Register a new userExploiting Row-Level Temporal Locality in DRAM to Reduce the Memory Access Latency
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Hasan Ibrahim Hasan
Publication date
2018
fields
Informatics Engineering
and research's language is
English
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This paper summarizes the idea of ChargeCache, which was published in HPCA 2016 [51], and examines the works significance and future potential. DRAM latency continues to be a critical bottleneck for system performance. In this work, we develop a low-cost mechanism, called ChargeCache, that enables faster access to recently-accessed rows in DRAM, with no modifications to DRAM chips. Our mechanism is based on the key observation that a recently-accessed row has more charge and thus the following access to the same row can be performed faster. To exploit this observation, we propose to track the addresses of recently-accessed rows in a table in the memory controller. If a later DRAM request hits in that table, the memory controller uses lower timing parameters, leading to reduced DRAM latency. Row addresses are removed from the table after a specified duration to ensure rows that have leaked too much charge are not accessed with lower latency. We evaluate ChargeCache on a wide variety of workloads and show that it provides significant performance and energy benefits for both single-core and multi-core systems.
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DRAM-based memory is a critical factor that creates a bottleneck on the system performance since the processor speed largely outperforms the DRAM latency. In this thesis, we develop a low-cost mechanism, called ChargeCache, which enables faster access to recently-accessed rows in DRAM, with no modifications to DRAM chips. Our mechanism is based on the key observation that a recently-accessed row has more charge and thus the following access to the same row can be performed faster. To exploit this observation, we propose to track the addresses of recently-accessed rows in a table in the memory controller. If a later DRAM request hits in that table, the memory controller uses lower timing parameters, leading to reduced DRAM latency. Row addresses are removed from the table after a specified duration to ensure rows that have leaked too much charge are not accessed with lower latency. We evaluate ChargeCache on a wide variety of workloads and show that it provides significant performance and energy benefits for both single-core and multi-core systems.
This paper summarizes the idea of Subarray-Level Parallelism (SALP) in DRAM, which was published in ISCA 2012, and examines the works significance and future potential. Modern DRAMs have multiple banks to serve multiple memory requests in parallel. However, when two requests go to the same bank, they have to be served serially, exacerbating the high latency of on-chip memory. Adding more banks to the system to mitigate this problem incurs high system cost. Our goal in this work is to achieve the benefits of increasing the number of banks with a low-cost approach. To this end, we propose three new mechanisms, SALP-1, SALP-2, and MASA (Multitude of Activated Subarrays), to reduce the serialization of different requests that go to the same bank. The key observation exploited by our mechanisms is that a modern DRAM bank is implemented as a collection of subarrays that operate largely independently while sharing few global peripheral structures. Our three proposed mechanisms mitigate the negative impact of bank serialization by overlapping different components of the bank access latencies of multiple requests that go to different subarrays within the same bank. SALP-1 requires no changes to the existing DRAM structure, and needs to only reinterpret some of the existing DRAM timing parameters. SALP-2 and MASA require only modest changes (< 0.15% area overhead) to the DRAM peripheral structures, which are much less design constrained than the DRAM core. Our evaluations show that SALP-1, SALP-2 and MASA significantly improve performance for both single-core systems (7%/13%/17%) and multi-core systems (15%/16%/20%), averaged across a wide range of workloads. We also demonstrate that our mechanisms can be combined with application-aware memory request scheduling in multicore systems to further improve performance and fairness.
Over the past two decades, the storage capacity and access bandwidth of main memory have improved tremendously, by 128x and 20x, respectively. These improvements are mainly due to the continuous technology scaling of DRAM (dynamic random-access memory), which has been used as the physical substrate for main memory. In stark contrast with capacity and bandwidth, DRAM latency has remained almost constant, reducing by only 1.3x in the same time frame. Therefore, long DRAM latency continues to be a critical performance bottleneck in modern systems. Increasing core counts, and the emergence of increasingly more data-intensive and latency-critical applications further stress the importance of providing low-latency memory access. In this dissertation, we identify three main problems that contribute significantly to long latency of DRAM accesses. To address these problems, we present a series of new techniques. Our new techniques significantly improve both system performance and energy efficiency. We also examine the critical relationship between supply voltage and latency in modern DRAM chips and develop new mechanisms that exploit this voltage-latency trade-off to improve energy efficiency. The key conclusion of this dissertation is that augmenting DRAM architecture with simple and low-cost features, and developing a better understanding of manufactured DRAM chips together lead to significant memory latency reduction as well as energy efficiency improvement. We hope and believe that the proposed architectural techniques and the detailed experimental data and observations on real commodity DRAM chips presented in this dissertation will enable development of other new mechanisms to improve the performance, energy efficiency, or reliability of future memory systems.
This paper summarizes our work on experimental characterization and analysis of reduced-voltage operation in modern DRAM chips, which was published in SIGMETRICS 2017, and examines the works significance and future potential. We take a comprehensive approach to understanding and exploiting the latency and reliability characteristics of modern DRAM when the DRAM supply voltage is lowered below the nominal voltage level specified by DRAM standards. We perform an experimental study of 124 real DDR3L (low-voltage) DRAM chips manufactured recently by three major DRAM vendors. We find that reducing the supply voltage below a certain point introduces bit errors in the data, and we comprehensively characterize the behavior of these errors. We discover that these errors can be avoided by increasing the latency of three major DRAM operations (activation, restoration, and precharge). We perform detailed DRAM circuit simulations to validate and explain our experimental findings. We also characterize the various relationships between reduced supply voltage and error locations, stored data patterns, DRAM temperature, and data retention. Based on our observations, we propose a new DRAM energy reduction mechanism, called Voltron. The key idea of Voltron is to use a performance model to determine by how much we can reduce the supply voltage without introducing errors and without exceeding a user-specified threshold for performance loss. Our evaluations show that Voltron reduces the average DRAM and system energy consumption by 10.5% and 7.3%, respectively, while limiting the average system performance loss to only 1.8%, for a variety of memory-intensive quad-core workloads. We also show that Voltron significantly outperforms prior dynamic voltage and frequency scaling mechanisms for DRAM.
DRAM is the prevalent main memory technology, but its long access latency can limit the performance of many workloads. Although prior works provide DRAM designs that reduce DRAM access latency, their reduced storage capacities hinder the performance of workloads that need large memory capacity. Because the capacity-latency trade-off is fixed at design time, previous works cannot achieve maximum performance under very different and dynamic workload demands. This paper proposes Capacity-Latency-Reconfigurable DRAM (CLR-DRAM), a new DRAM architecture that enables dynamic capacity-latency trade-off at low cost. CLR-DRAM allows dynamic reconfiguration of any DRAM row to switch between two operating modes: 1) max-capacity mode, where every DRAM cell operates individually to achieve approximately the same storage density as a density-optimized commodity DRAM chip and 2) high-performance mode, where two adjacent DRAM cells in a DRAM row and their sense amplifiers are coupled to operate as a single low-latency logical cell driven by a single logical sense amplifier. We implement CLR-DRAM by adding isolation transistors in each DRAM subarray. Our evaluations show that CLR-DRAM can improve system performance and DRAM energy consumption by 18.6% and 29.7% on average with four-core multiprogrammed workloads. We believe that CLR-DRAM opens new research directions for a system to adapt to the diverse and dynamically changing memory capacity and access latency demands of workloads.
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