We analyze the temperature dependence of conductivity in thick granular ferromagnetic compounds NiSiO2 and in thin weakly coupled films of Fe, Ni and Py in vicinity of metal-insulator transition. Development of resistivity minimum followed by a logarithmic variation of conductivity at lower temperatures is attributed to granular structure of compounds and thin films fabricated by conventional deposition techniques. Resistivity minimum is identified as a transition between temperature dependent intra-granular metallic conductance and thermally activated inter-granular tunneling.