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Microfabrication technology for large LEKID arrays : from NIKA2 to future applications

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 Added by Johannes Goupy
 Publication date 2016
  fields Physics
and research's language is English




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The Lumped Element Kinetic Inductance Detectors (LEKID)demonstrated full maturity in the NIKA (New IRAM KID Arrays)instrument. These results allow directly comparing LEKID performance with other competing technologies (TES, doped silicon) in the mm and sub-mm range. A continuing effort is ongoing to improve the microfabrication technologies and concepts in order to satisfy the requirements of new instruments. More precisely, future satellites dedicated to CMB (Cosmic Microwave Background) studies will require the same focal plane technology to cover, at least, the frequency range of 60 to 600 GHz. Aluminium LEKID developed for NIKA have so far demonstrated, under real telescope conditions, performance approaching photon-noise limitation in the band 120-300 GHz. By implementing superconducting bi-layers we recently demonstrated LEKID arrays working in the range 80-120 GHz and with sensitivities approaching the goals for CMB missions. NIKA itself (350 pixels) is followed by a more ambitious project requiring several thousands (3000-5000) pixels. NIKA2 has been installed in October 2015 at the IRAM 30-m telescope. We will describe in detail the technological improvements that allowed a relatively harmless 10-fold up-scaling in pixels count without degrading the initial sensitivity. In particular we will briefly describe a solution to simplify the difficult fabrication step linked to the slot-line propagation mode in coplanar waveguide.



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We report the design, fabrication and testing of Lumped Element Kinetic Inductance Detectors (LEKID) showing performance in line with the requirements of the next generation space telescopes operating in the spectral range from 80 to 600 GHz. This range is of particular interest for Cosmic Microwave Background (CMB) studies. For this purpose we have designed and fabricated 100-pixel arrays covering five distinct bands. These wafers have been measured via multiplexing, where a full array is read out using a single pair of lines. We adopted a custom cold black-body installed in front of the detectors and regulated at temperatures between 1 K and 20 K. We will describe in the present paper the main design considerations, the fabrication processes, the testing and the data analysis.
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