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Register a new userGeneric failure mechanisms in adhesive bonds
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The failure of adhesive bondlines has been studied at the microscopic level via tensile tests. Stable crack propagation could be generated by means of samples with improved geometry, which made in-situ observations possible. The interaction of cracks with adhesive bondlines under various angles to the crack propagation was the focus of this study as well as the respective loading situations for the adhesives UF, PUR, and PVAc, which have distinctly different mechanical behaviors. It is shown how adhesive properties influence the occurrence of certain failure mechanisms and determine their appearance and order of magnitude. With the observed failure mechanisms, it becomes possible to predict the propagation path of a crack through the specimen.
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We propose a model to analyze the insurgence of pull-in and wrinkling failures in electroactive thin films. We take in consideration both cases of voltage and charge control, and study the role of prestretch and size of activated regions, which are essential in the analysis of realistic applications of EAPs. Based on simple geometrical and material assumptions we deduce an explicit analytical description of these phenomena, allowing a clear physical interpretation. Despite our simplifying assumptions, the comparison with experiments shows a satisfying qualitative and, interestingly, quantitative agreement. In particular our model shows, in accordance with experiments, the existence of different optimal prestretch values, depending on the choice of the actuating parameter of the EAP.
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