The study of the Cu-Sn-In ternary system has become of great importance in recent years, due to new environmental regulations forcing to eliminate the use of Pb in bonding technologies for electronic devices. A key relevant issue concerns the intermetallic phases which grow in the bonding zone and are determining in their quality and performance. In this work, we focus in the {eta}-phase (Cu2In or Cu6Sn5) that exists in both end binaries and as a ternary phase. We present a neutron diffraction study of the constitution and crystallography of a series of alloys around the 60 at.% Cu composition, and with In contents ranging from 0 to 25 at.%, quenched from 300degreeC. The alloys were characterized by scanning electron microscopy, probe microanalysis and high-resolution neutron diffraction. The Rietveld refinement of neutron diffraction data allowed to improve the currently available model for site occupancies in the hexagonal {eta}-phase in the binary Cu-Sn as well as in ternary alloys. For the first time, structural data is reported in the ternary Cu-Sn-In {eta}-phase as a function of composition, information that is of fundamental technological importance as well as valuable input data for ongoing modelisations of the ternary phase diagram.
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